Nippon Denkai, Ltd.

Organization

Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper foil and method for producing same
- Patent number 12,091,766
- Issue date Sep 17, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil and method for manufacturing same
- Patent number 11,952,675
- Issue date Apr 9, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite copper foil and method for production thereof
- Patent number 7,816,015
- Issue date Oct 19, 2010
- Nippon Denkai, Ltd.
- Yuushi Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for producing electrolytic copper foil
- Patent number 6,663,758
- Issue date Dec 16, 2003
- Nippon Denkai, Ltd.
- Shigetada Motohashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of producing a roughening-treated copper foil
- Patent number 6,497,806
- Issue date Dec 24, 2002
- Nippon Denkai, Ltd.
- Yasuhiro Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing copper foil for fine wiring
- Patent number 6,495,022
- Issue date Dec 17, 2002
- Nippon Denkai, Ltd.
- Yasuhiro Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for tape carrier and tab carrier tape and tab tape carr...
- Patent number 6,461,745
- Issue date Oct 8, 2002
- Nippon Denkai, Ltd.
- Ayumi Endo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lead frame material
- Patent number 6,117,566
- Issue date Sep 12, 2000
- Nippon Denkai, Ltd.
- Tatsunori Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil for printed wiring board
- Patent number 5,712,047
- Issue date Jan 27, 1998
- Nippon Denkai, Ltd.
- Kazuyoshi Aso
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper clad laminate, multilayer printed circuit board and their pr...
- Patent number 5,569,545
- Issue date Oct 29, 1996
- Nippon Denkai Ltd.
- Hitoshi Yokono
- B32 - LAYERED PRODUCTS
Information Patent Grant
Non-cyanide copper-zinc electroplating bath, method of surface trea...
- Patent number 5,534,128
- Issue date Jul 9, 1996
- Nippon Denkai, Ltd.
- Kazuyoshi Aso
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer material having a resistance layer formed on an electric...
- Patent number 5,061,550
- Issue date Oct 29, 1991
- Nippon Denkai, Co. Ltd.
- Kazunao Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED COPPER FOIL
- Publication number 20240308183
- Publication date Sep 19, 2024
- NIPPON DENKAI, LTD.
- Yasuhiro ENDO
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL FOIL AND PRODUCTION METHOD THEREFOR, AND METHOD FOR PROCESSIN...
- Publication number 20230072579
- Publication date Mar 9, 2023
- NIPPON DENKAI, LTD.
- Hiroshi KOGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME
- Publication number 20230043755
- Publication date Feb 9, 2023
- NIPPON DENKAI, LTD.
- Toshio KAWASAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING SAME
- Publication number 20220112618
- Publication date Apr 14, 2022
- NIPPON DENKAI, LTD.
- Toshio KAWASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Trademarklast 30 trademarks

Information Trademark
97639135 - DENKAI COPPER
- Serial number 97639135
- Filing date Oct 19, 2022
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys
Information Trademark
90254529 - SEED
- Serial number 90254529
- Registration number 7001086
- Filing date Oct 14, 2020
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys
Information Trademark
90254499 - NAP
- Serial number 90254499
- Filing date Oct 14, 2020
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys
Information Trademark
90254518 - HL
- Serial number 90254518
- Filing date Oct 14, 2020
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys
Information Trademark
88772769 - NIPPON DENKAI
- Serial number 88772769
- Filing date Jan 24, 2020
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys
Information Trademark
88772778 - ND
- Serial number 88772778
- Registration number 7127603
- Filing date Jan 24, 2020
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys
Information Trademark
88772755 - DENKAI AMERICA
- Serial number 88772755
- Registration number 6965815
- Filing date Jan 24, 2020
- Nippon Denkai, Ltd.
- 6 - Common metals and their alloys

Nippon Denkai, Ltd.

Organization

Patents Grantslast 30 patents

Electrolytic copper foil and method for producing same

Surface-treated copper foil and method for manufacturing same

Composite copper foil and method for production thereof

Method and apparatus for producing electrolytic copper foil

Method of producing a roughening-treated copper foil

Method of producing copper foil for fine wiring

Copper foil for tape carrier and tab carrier tape and tab tape carr...

Lead frame material

Copper foil for printed wiring board

Copper clad laminate, multilayer printed circuit board and their pr...

Non-cyanide copper-zinc electroplating bath, method of surface trea...

Multilayer material having a resistance layer formed on an electric...

Patents Applicationslast 30 patents

SURFACE-TREATED COPPER FOIL

METAL FOIL AND PRODUCTION METHOD THEREFOR, AND METHOD FOR PROCESSIN...

SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME

ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING SAME

Trademarklast 30 trademarks

97639135 - DENKAI COPPER

90254529 - SEED

90254499 - NAP

90254518 - HL

88772769 - NIPPON DENKAI

88772778 - ND

88772755 - DENKAI AMERICA