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NIPPON MICROMETAL CORPORATION

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  • Saitama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Copper bonding wire
    • Patent number 12,334,467
    • Issue date Jun 17, 2025
    • Nippon Micrometal Corporation
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    AI wiring material
    • Patent number 12,325,901
    • Issue date Jun 10, 2025
    • Nippon Micrometal Corporation
    • Yuto Kurihara
    • C21 - METALLURGY OF IRON
  • Information Patent Grant

    Copper alloy bonding wire for semiconductor devices
    • Patent number 12,300,658
    • Issue date May 13, 2025
    • Nippon Micrometal Corporation
    • Daizo Oda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire
    • Patent number 12,290,883
    • Issue date May 6, 2025
    • Nippon Micrometal Corporation
    • Daizo Oda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 12,166,006
    • Issue date Dec 10, 2024
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Junction structure, method for manufacturing junction structure, an...
    • Patent number 12,157,189
    • Issue date Dec 3, 2024
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Masamoto Tanaka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire
    • Patent number 12,132,025
    • Issue date Oct 29, 2024
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • C21 - METALLURGY OF IRON
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 12,132,026
    • Issue date Oct 29, 2024
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Al bonding wire
    • Patent number 12,090,578
    • Issue date Sep 17, 2024
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,929,343
    • Issue date Mar 12, 2024
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,721,660
    • Issue date Aug 8, 2023
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ag alloy bonding wire for semiconductor device
    • Patent number 11,612,966
    • Issue date Mar 28, 2023
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 11,373,934
    • Issue date Jun 28, 2022
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,342,299
    • Issue date May 24, 2022
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Cu pillar cylindrical preform for semiconductor connection
    • Patent number 11,101,234
    • Issue date Aug 24, 2021
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy bonding wire for semiconductor device
    • Patent number 10,991,672
    • Issue date Apr 27, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cu alloy bonding wire for semiconductor device
    • Patent number 10,985,130
    • Issue date Apr 20, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,950,570
    • Issue date Mar 16, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,950,571
    • Issue date Mar 16, 2021
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,840,208
    • Issue date Nov 17, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy bonding wire for semiconductor device
    • Patent number 10,790,259
    • Issue date Sep 29, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,737,356
    • Issue date Aug 11, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy core bonding wire with Pd coating for semiconductor device
    • Patent number 10,672,733
    • Issue date Jun 2, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,610,976
    • Issue date Apr 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,529,683
    • Issue date Jan 7, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,525,555
    • Issue date Jan 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy core bonding wire with Pd coating for semiconductor device
    • Patent number 10,497,663
    • Issue date Dec 3, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,468,370
    • Issue date Nov 5, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Cu alloy core bonding wire with Pd coating for semiconductor device
    • Patent number 10,461,055
    • Issue date Oct 29, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,414,002
    • Issue date Sep 17, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING WIRE
    • Publication number 20250114877
    • Publication date Apr 10, 2025
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240297142
    • Publication date Sep 5, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290743
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290745
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290744
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240266313
    • Publication date Aug 8, 2024
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tomohiro UNO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AI WIRING MATERIAL
    • Publication number 20240110262
    • Publication date Apr 4, 2024
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro UNO
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    AI WIRING MATERIAL
    • Publication number 20240105668
    • Publication date Mar 28, 2024
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240071978
    • Publication date Feb 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Yuya SUTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Al WIRING MATERIAL
    • Publication number 20230302584
    • Publication date Sep 28, 2023
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro UNO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR D...
    • Publication number 20230154884
    • Publication date May 18, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230146315
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230142531
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230148306
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Motoki ETO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER BONDING WIRE
    • Publication number 20230105851
    • Publication date Apr 6, 2023
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro UNO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
    • Publication number 20230013769
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Ryo OISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230018430
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AL WIRING MATERIAL
    • Publication number 20220341004
    • Publication date Oct 27, 2022
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • C21 - METALLURGY OF IRON
  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20220266396
    • Publication date Aug 25, 2022
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AN...
    • Publication number 20220241903
    • Publication date Aug 4, 2022
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Masamoto TANAKA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20220152749
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE
    • Publication number 20220157766
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20220108971
    • Publication date Apr 7, 2022
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20210043599
    • Publication date Feb 11, 2021
    • NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
    • Tetsuya Oyamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200373226
    • Publication date Nov 26, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20200312808
    • Publication date Oct 1, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200279824
    • Publication date Sep 3, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya OYAMADA
    • H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks