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Saitama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Copper bonding wire
Patent number
12,334,467
Issue date
Jun 17, 2025
Nippon Micrometal Corporation
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
AI wiring material
Patent number
12,325,901
Issue date
Jun 10, 2025
Nippon Micrometal Corporation
Yuto Kurihara
C21 - METALLURGY OF IRON
Information
Patent Grant
Copper alloy bonding wire for semiconductor devices
Patent number
12,300,658
Issue date
May 13, 2025
Nippon Micrometal Corporation
Daizo Oda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire
Patent number
12,290,883
Issue date
May 6, 2025
Nippon Micrometal Corporation
Daizo Oda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
12,166,006
Issue date
Dec 10, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Junction structure, method for manufacturing junction structure, an...
Patent number
12,157,189
Issue date
Dec 3, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Masamoto Tanaka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire
Patent number
12,132,025
Issue date
Oct 29, 2024
Nippon Micrometal Corporation
Takashi Yamada
C21 - METALLURGY OF IRON
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
12,132,026
Issue date
Oct 29, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Al bonding wire
Patent number
12,090,578
Issue date
Sep 17, 2024
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
11,929,343
Issue date
Mar 12, 2024
Nippon Micrometal Corporation
Daizo Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
11,721,660
Issue date
Aug 8, 2023
Nippon Micrometal Corporation
Daizo Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ag alloy bonding wire for semiconductor device
Patent number
11,612,966
Issue date
Mar 28, 2023
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
11,373,934
Issue date
Jun 28, 2022
Nippon Micrometal Corporation
Daizo Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
11,342,299
Issue date
May 24, 2022
Nippon Micrometal Corporation
Daizo Oda
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Cu pillar cylindrical preform for semiconductor connection
Patent number
11,101,234
Issue date
Aug 24, 2021
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cu alloy bonding wire for semiconductor device
Patent number
10,991,672
Issue date
Apr 27, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cu alloy bonding wire for semiconductor device
Patent number
10,985,130
Issue date
Apr 20, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,950,570
Issue date
Mar 16, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,950,571
Issue date
Mar 16, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,840,208
Issue date
Nov 17, 2020
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cu alloy bonding wire for semiconductor device
Patent number
10,790,259
Issue date
Sep 29, 2020
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,737,356
Issue date
Aug 11, 2020
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
Patent number
10,672,733
Issue date
Jun 2, 2020
Nippon Micrometal Corporation
Takashi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,610,976
Issue date
Apr 7, 2020
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,529,683
Issue date
Jan 7, 2020
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,525,555
Issue date
Jan 7, 2020
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
Patent number
10,497,663
Issue date
Dec 3, 2019
Nippon Micrometal Corporation
Takashi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,468,370
Issue date
Nov 5, 2019
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
Patent number
10,461,055
Issue date
Oct 29, 2019
Nippon Micrometal Corporation
Takashi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,414,002
Issue date
Sep 17, 2019
Nippon Micrometal Corporation
Takashi Yamada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
BONDING WIRE
Publication number
20250114877
Publication date
Apr 10, 2025
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240297142
Publication date
Sep 5, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240290743
Publication date
Aug 29, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
G01 - MEASURING TESTING
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240290745
Publication date
Aug 29, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
G01 - MEASURING TESTING
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240290744
Publication date
Aug 29, 2024
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240266313
Publication date
Aug 8, 2024
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro UNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AI WIRING MATERIAL
Publication number
20240110262
Publication date
Apr 4, 2024
NIPPON MICROMETAL CORPORATION
Tomohiro UNO
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
AI WIRING MATERIAL
Publication number
20240105668
Publication date
Mar 28, 2024
NIPPON MICROMETAL CORPORATION
Yuto KURIHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240071978
Publication date
Feb 29, 2024
NIPPON MICROMETAL CORPORATION
Yuya SUTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230387066
Publication date
Nov 30, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230335528
Publication date
Oct 19, 2023
NIPPON MICROMETAL COPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Al WIRING MATERIAL
Publication number
20230302584
Publication date
Sep 28, 2023
NIPPON MICROMETAL CORPORATION
Tomohiro UNO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230245995
Publication date
Aug 3, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR D...
Publication number
20230154884
Publication date
May 18, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AL BONDING WIRE
Publication number
20230142531
Publication date
May 11, 2023
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AL BONDING WIRE
Publication number
20230146315
Publication date
May 11, 2023
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230148306
Publication date
May 11, 2023
NIPPON MICROMETAL CORPORATION
Motoki ETO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER BONDING WIRE
Publication number
20230105851
Publication date
Apr 6, 2023
NIPPON MICROMETAL CORPORATION
Tomohiro UNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
Publication number
20230013769
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Ryo OISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
AL WIRING MATERIAL
Publication number
20220341004
Publication date
Oct 27, 2022
NIPPON MICROMETAL CORPORATION
Yuto KURIHARA
C21 - METALLURGY OF IRON
Information
Patent Application
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20220266396
Publication date
Aug 25, 2022
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya OYAMADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AN...
Publication number
20220241903
Publication date
Aug 4, 2022
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Masamoto TANAKA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
AL BONDING WIRE
Publication number
20220152749
Publication date
May 19, 2022
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING WIRE
Publication number
20220157766
Publication date
May 19, 2022
NIPPON MICROMETAL CORPORATION
Takashi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20220108971
Publication date
Apr 7, 2022
NIPPON MICROMETAL CORPORATION
Daizo ODA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20210043599
Publication date
Feb 11, 2021
NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
Tetsuya Oyamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20200373226
Publication date
Nov 26, 2020
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20200312808
Publication date
Oct 1, 2020
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20200279824
Publication date
Sep 3, 2020
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya OYAMADA
H01 - BASIC ELECTRIC ELEMENTS
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