Nippon Mining & Metals Co. , Ltd.

Organization

Ibaraki-ken, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
InP single crystal wafer and method for producing InP single crystal
- Patent number 8,815,010
- Issue date Aug 26, 2014
- Nippon Mining & Metals Co., Ltd.
- Akira Noda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,736,057
- Issue date May 27, 2014
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for recovering metal from ore
- Patent number 8,585,798
- Issue date Nov 19, 2013
- Nippon Mining & Metals Co., Ltd.
- Yoshifumi Abe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Two-layer flexible substrate
- Patent number 8,568,856
- Issue date Oct 29, 2013
- Nippon Mining & Metals Co., Ltd.
- Katsuyuki Tsuchida
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat treatment method of ZnTe single crystal substrate and ZnTe sin...
- Patent number 8,476,171
- Issue date Jul 2, 2013
- Nippon Mining & Metals Co., Ltd.
- Toshiaki Asahi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Copper electrolytic solution containing amine compound having speci...
- Patent number 8,449,751
- Issue date May 28, 2013
- Nippon Mining & Metals Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless copper plating solution
- Patent number 8,404,035
- Issue date Mar 26, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating
- Patent number 8,394,508
- Issue date Mar 12, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
ULSI micro-interconnect member having ruthenium electroplating laye...
- Patent number 8,390,123
- Issue date Mar 5, 2013
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,247,301
- Issue date Aug 21, 2012
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epitaxial growth process
- Patent number 8,231,728
- Issue date Jul 31, 2012
- Nippon Mining & Metals Co., Ltd.
- Misao Takakusaki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for electroless plating and metal-plated article
- Patent number 8,182,873
- Issue date May 22, 2012
- Nippon Mining & Metals Co., Ltd
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless nickel plating liquid
- Patent number 8,182,594
- Issue date May 22, 2012
- Nippon Mining & Metals Co., Ltd
- Eiji Hino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating...
- Patent number 8,163,400
- Issue date Apr 24, 2012
- Nippon Mining & Metals Co., Ltd
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of GaN thin film template substrate, GaN thin...
- Patent number 8,137,460
- Issue date Mar 20, 2012
- Nippon Mining & Metals Co., Ltd.
- Satoru Morioka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Electronic component formed with barrier-seed layer on base material
- Patent number 8,089,154
- Issue date Jan 3, 2012
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin substrate material, electronic component substrate material m...
- Patent number 8,043,705
- Issue date Oct 25, 2011
- Nippon Mining & Metals Co., Ltd.
- Toshifumi Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component formed with barrier-seed layer on base material
- Patent number 8,004,082
- Issue date Aug 23, 2011
- Nippon Mining & Metals Co., Ltd
- Junnosuke Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of surface treatment using imidazole compound
- Patent number 7,968,150
- Issue date Jun 28, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vapor phase growth method
- Patent number 7,883,998
- Issue date Feb 8, 2011
- Nippon Mining & Metals Co., Ltd.
- Masashi Nakamura
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor substrate for epitaxial growth and manufacturing meth...
- Patent number 7,875,957
- Issue date Jan 25, 2011
- Nippon Mining & Metals Co., Ltd.
- Kenji Suzuki
- C30 - CRYSTAL GROWTH
Information Patent Grant
Metal plating method and pretreatment agent
- Patent number 7,867,564
- Issue date Jan 11, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electrolytic solution containing as additive compound having...
- Patent number 7,824,534
- Issue date Nov 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Katsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sb-Te alloy sintered compact sputtering target
- Patent number 7,803,209
- Issue date Sep 28, 2010
- Nippon Mining & Metals Co., Ltd.
- Hideyuki Takahashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cathode material for lithium secondary battery and manufacturing me...
- Patent number 7,799,301
- Issue date Sep 21, 2010
- Nippon Mining & Metals Co., Ltd.
- Yoshio Kajiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,799,188
- Issue date Sep 21, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hydrogen separation membrane, sputtering target for forming said hy...
- Patent number 7,789,948
- Issue date Sep 7, 2010
- Nippon Mining & Metals Co., Ltd.
- Atsushi Nakamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Packaging device and packaging method for hollow cathode type sputt...
- Patent number 7,788,882
- Issue date Sep 7, 2010
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of operating non-ferrous smelting plant
- Patent number 7,776,133
- Issue date Aug 17, 2010
- Nippon Mining & Metals Co., Ltd.
- Kenta Nakagawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper electrolytic solution containing quaternary amine compound w...
- Patent number 7,771,835
- Issue date Aug 10, 2010
- Nippon Mining & Metals Co., Ltd.
- Masashi Kumagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAI...
- Publication number 20120189811
- Publication date Jul 26, 2012
- NIPPON MINING & METALS CO., LTD.
- Mikio HANAFUSA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Hybrid Silicon Wafer and Method of Producing the Same
- Publication number 20120009373
- Publication date Jan 12, 2012
- Nippon Mining & Metals Co., Ltd.
- Hiroshi Takamura
- C30 - CRYSTAL GROWTH
Information Patent Application
Hybrid Silicon Wafer and Method of Producing the Same
- Publication number 20120009374
- Publication date Jan 12, 2012
- Nippon Mining & Metals Co., Ltd.
- Hiroshi Takamura
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR PRODUCING a-IGZO OXIDE THIN FILM
- Publication number 20110306165
- Publication date Dec 15, 2011
- Nippon Mining & Metals Co., Ltd.
- Masakatsu Ikisawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREPARATION METHOD OF LITHIUM CARBONATE FROM LITHIUM-ION SECONDARY...
- Publication number 20110002825
- Publication date Jan 6, 2011
- Nippon Mining & Metals Co., Ltd.
- Toshiyuki YAMAOKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Non-Adhesive Flexible Laminate
- Publication number 20110003169
- Publication date Jan 6, 2011
- Nippon Mining & Metals Co., Ltd.
- Nobuhito Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sintered Silicon Wafer
- Publication number 20100330325
- Publication date Dec 30, 2010
- Nippon Mining & Metals Co., Ltd.
- Ryo Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic M...
- Publication number 20100320084
- Publication date Dec 23, 2010
- Nippon Mining & Metals Co., Ltd.
- Atsushi Sato
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Sputtering Target for Producing Metallic Glass Membrane and Manufac...
- Publication number 20100320085
- Publication date Dec 23, 2010
- Nippon Mining & Metals Co., Ltd.
- Atsushi Nakamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Non-Adhesive-Type Flexible Laminate and Method for Production Thereof
- Publication number 20100323215
- Publication date Dec 23, 2010
- Nippon Mining & Metals Co., Ltd.
- Nobuhito Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Collection of Valuable Metal from ITO Scrap
- Publication number 20100316544
- Publication date Dec 16, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100307923
- Publication date Dec 9, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sintered Oxide Compact Target for Sputtering and Process for Produc...
- Publication number 20100300878
- Publication date Dec 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Kozo Osada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Collection of Valuable Metal from ITO Scrap
- Publication number 20100294082
- Publication date Nov 25, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Recovering Valuable Metals from IZO Scrap
- Publication number 20100288646
- Publication date Nov 18, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Recovering Valuable Metals from IZO Scrap
- Publication number 20100288645
- Publication date Nov 18, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Recovering Valuable Metals from IZO Scrap
- Publication number 20100282615
- Publication date Nov 11, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Thin Film Mainly Comprising Titanium Oxide, Sintered Sputtering Tar...
- Publication number 20100276276
- Publication date Nov 4, 2010
- Nippon Mining & Metals Co., Ltd.
- Hideo Takami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High strength titanium copper alloy, manufacturing method therefor,...
- Publication number 20100276037
- Publication date Nov 4, 2010
- Nippon Mining & Metals Co., Ltd.
- Michiharu Yamamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Producing Two-Layered Copper-Clad Laminate, and Two-Layer...
- Publication number 20100279069
- Publication date Nov 4, 2010
- Nippon Mining & Metals Co., Ltd.
- Mikio Hanafusa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lan...
- Publication number 20100272596
- Publication date Oct 28, 2010
- Nippon Mining & Metals Co., Ltd.
- Masahiro Takahata
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS
- Publication number 20100266863
- Publication date Oct 21, 2010
- Nippon Mining & Metals Co., Ltd.
- Koichiro Tanaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
High Purity Ytterbium, Sputtering Target Made Thereof, Thin Film Co...
- Publication number 20100260640
- Publication date Oct 14, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper Foil for Printed Circuit Board and Copper Clad Laminate for...
- Publication number 20100261033
- Publication date Oct 14, 2010
- Nippon Mining & Metals Co., Ltd.
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
High-Purity Ni-V Alloy, Target therefrom, High-Purity Ni-V Alloy Th...
- Publication number 20100242674
- Publication date Sep 30, 2010
- Nippon Mining & Metals Co., Ltd.
- Yuichiro Shindo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Sputtering Target, Thin Film for Optical Information Recording Medi...
- Publication number 20100240521
- Publication date Sep 23, 2010
- Nippon Mining & Metals Co., Ltd.
- Hideo Hosono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electrolytic solution containing as additive compound having...
- Publication number 20100224496
- Publication date Sep 9, 2010
- NIPPON MINING & METALS CO., LTD.
- Katsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Iron Silicide Powder and Method for Production Thereof
- Publication number 20100221170
- Publication date Sep 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Kunihiro Oda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Alloy Sputtering Target, Process for Producing the Same and...
- Publication number 20100219070
- Publication date Sep 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal Covered Polyimide Composite, Process for Producing the Compos...
- Publication number 20100221563
- Publication date Sep 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

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Trademarklast 30 trademarks

Information Trademark
77875470 - CLEEN 6N CU
- Serial number 77875470
- Registration number 4202711
- Filing date Nov 18, 2009
- Nippon Mining & Metals Co., Ltd.
- 6 - Common metals and their alloys
Information Trademark
77400334 - PXSI
- Serial number 77400334
- Registration number 3637490
- Filing date Feb 19, 2008
- Nippon Mining & Metals Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78549022 - MAQINAS
- Serial number 78549022
- Registration number 3382796
- Filing date Jan 18, 2005
- NIKKO MATERIALS CO., LTD.
- 17 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes
Information Trademark
76363558 - HPTC
- Serial number 76363558
- Filing date Jan 22, 2002
- Nippon Mining & Metals Co., Ltd.
- 6 - Common metals and their alloys

Nippon Mining & Metals Co. , Ltd.

Organization

Patents Grantslast 30 patents

InP single crystal wafer and method for producing InP single crystal

Substrate and manufacturing method therefor

Method for recovering metal from ore

Two-layer flexible substrate

Heat treatment method of ZnTe single crystal substrate and ZnTe sin...

Copper electrolytic solution containing amine compound having speci...

Electroless copper plating solution

Plated article having metal thin film formed by electroless plating

ULSI micro-interconnect member having ruthenium electroplating laye...

Substrate and manufacturing method therefor

Epitaxial growth process

Method for electroless plating and metal-plated article

Electroless nickel plating liquid

Plated article having metal thin film formed by electroless plating...

Manufacturing method of GaN thin film template substrate, GaN thin...

Electronic component formed with barrier-seed layer on base material

Resin substrate material, electronic component substrate material m...

Electronic component formed with barrier-seed layer on base material

Method of surface treatment using imidazole compound

Vapor phase growth method

Semiconductor substrate for epitaxial growth and manufacturing meth...

Metal plating method and pretreatment agent

Copper electrolytic solution containing as additive compound having...

Sb-Te alloy sintered compact sputtering target

Cathode material for lithium secondary battery and manufacturing me...

Electrolytic copper plating method, pure copper anode for electroly...

Hydrogen separation membrane, sputtering target for forming said hy...

Packaging device and packaging method for hollow cathode type sputt...

Method of operating non-ferrous smelting plant

Copper electrolytic solution containing quaternary amine compound w...

Patents Applicationslast 30 patents

COPPER ELECTROLYTIC SOLUTION AND TWO-LAYER FLEXIBLE SUBSTRATE OBTAI...

Hybrid Silicon Wafer and Method of Producing the Same

Hybrid Silicon Wafer and Method of Producing the Same

METHOD FOR PRODUCING a-IGZO OXIDE THIN FILM

PREPARATION METHOD OF LITHIUM CARBONATE FROM LITHIUM-ION SECONDARY...

Non-Adhesive Flexible Laminate

Sintered Silicon Wafer

Sputtering Target of Nonmagnetic-Particle-Dispersed Ferromagnetic M...

Sputtering Target for Producing Metallic Glass Membrane and Manufac...

Non-Adhesive-Type Flexible Laminate and Method for Production Thereof

Method for Collection of Valuable Metal from ITO Scrap

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

Sintered Oxide Compact Target for Sputtering and Process for Produc...

Method for Collection of Valuable Metal from ITO Scrap

Method of Recovering Valuable Metals from IZO Scrap

Method of Recovering Valuable Metals from IZO Scrap

Method of Recovering Valuable Metals from IZO Scrap

Thin Film Mainly Comprising Titanium Oxide, Sintered Sputtering Tar...

High strength titanium copper alloy, manufacturing method therefor,...

Method of Producing Two-Layered Copper-Clad Laminate, and Two-Layer...

High-Purity Lanthanum, Sputtering Target Comprising High-Purity Lan...

Sn-PLATED MATERIALS FOR ELECTRONIC COMPONENTS

High Purity Ytterbium, Sputtering Target Made Thereof, Thin Film Co...

Copper Foil for Printed Circuit Board and Copper Clad Laminate for...

High-Purity Ni-V Alloy, Target therefrom, High-Purity Ni-V Alloy Th...

Sputtering Target, Thin Film for Optical Information Recording Medi...

Copper electrolytic solution containing as additive compound having...

Iron Silicide Powder and Method for Production Thereof

Copper Alloy Sputtering Target, Process for Producing the Same and...

Metal Covered Polyimide Composite, Process for Producing the Compos...

Trademarklast 30 trademarks

77875470 - CLEEN 6N CU

77400334 - PXSI

78549022 - MAQINAS

76363558 - HPTC