Octavo Systems LLC

Organization

Austin, TX, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Secure enclave system-in-package
- Patent number 12,001,363
- Issue date Jun 4, 2024
- OCTAVO SYSTEMS LLC
- Peter Robert Linder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System in a package modifications
- Patent number 11,869,823
- Issue date Jan 9, 2024
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance module for SiP
- Patent number 11,610,844
- Issue date Mar 21, 2023
- OCTAVO SYSTEMS LLC
- Gene Alan Frantz
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method of assembling a system
- Patent number 11,502,030
- Issue date Nov 15, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component communications in system-in-package systems
- Patent number 11,416,050
- Issue date Aug 16, 2022
- OCTAVO SYSTEMS LLC
- Kevin Michael Troy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Analog memory cells with valid flag
- Patent number 11,373,720
- Issue date Jun 28, 2022
- OCTAVO SYSTEMS LLC
- Peter Linder
- G11 - INFORMATION STORAGE
Information Patent Grant
Analog arithmetic unit
- Patent number 11,347,478
- Issue date May 31, 2022
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automatic test equipment method for testing system in a package dev...
- Patent number 11,309,056
- Issue date Apr 19, 2022
- OCTAVO SYSTEMS LLC
- Kevin Michael Troy
- G11 - INFORMATION STORAGE
Information Patent Grant
Mixed signal computer architecture
- Patent number 11,308,290
- Issue date Apr 19, 2022
- OCTAVO SYSTEMS LLC
- Gene Alan Frantz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
EMI shield for molded packages
- Patent number 11,302,648
- Issue date Apr 12, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package connectors
- Patent number 11,257,803
- Issue date Feb 22, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Service module for SIP devices
- Patent number 11,211,369
- Issue date Dec 28, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed signal computer
- Patent number 11,171,651
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Laurence Ray Simar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for routing bond wires in system in a package (SiP) devices
- Patent number 11,157,676
- Issue date Oct 26, 2021
- OCTAVO SYSTEMS LLC
- Neeraj Kumar Reddy Dantu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System-in-Package device ball map and layout optimization
- Patent number 11,032,910
- Issue date Jun 8, 2021
- OCTAVO SYSTEMS LLC
- Erik James Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit mounting structure and lead frame for system in package (SI...
- Patent number 10,867,979
- Issue date Dec 15, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shield for molded packages
- Patent number 10,714,430
- Issue date Jul 14, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of passive components in system-in-package devices
- Patent number 10,470,294
- Issue date Nov 5, 2019
- Octavo Systems LLC
- Erik James Welsh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate for system in package (SIP) devices
- Patent number 10,204,890
- Issue date Feb 12, 2019
- Octavo Systems LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SECURE ENCLAVE SYSTEM-IN-PACKAGE
- Publication number 20240289290
- Publication date Aug 29, 2024
- Octavo Systems LLC
- Peter Robert LINDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT
- Publication number 20240266243
- Publication date Aug 8, 2024
- Octavo Systems LLC
- Eshtaartha BASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE MODIFICATIONS
- Publication number 20240087975
- Publication date Mar 14, 2024
- Octavo Systems LLC
- Michael Kenneth CONTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE ENCLAVE SYSTEM-IN-PACKAGE
- Publication number 20230185748
- Publication date Jun 15, 2023
- Octavo Systems LLC
- Peter Robert LINDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
- Publication number 20220390970
- Publication date Dec 8, 2022
- Octavo Systems LLC
- Kevin Michael Troy
- G05 - CONTROLLING REGULATING
Information Patent Application
MOLDED PACKAGES IN A MOLDED DEVICE
- Publication number 20220028704
- Publication date Jan 27, 2022
- Octavo Systems LLC
- Masood MURTUZA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM IN A PACKAGE MODIFICATIONS
- Publication number 20210143075
- Publication date May 13, 2021
- Octavo Systems LLC
- Michael Kenneth CONTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALOG ARITHMETIC UNIT
- Publication number 20210072958
- Publication date Mar 11, 2021
- Octavo Systems LLC
- Erik James WELSH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MIXED SIGNAL COMPUTER
- Publication number 20200403618
- Publication date Dec 24, 2020
- Octavo Systems LLC
- Laurence Ray SIMAR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANALOG MEMORY CELLS WITH VALID FLAG
- Publication number 20200402601
- Publication date Dec 24, 2020
- Octavo Systems LLC
- Peter LINDER
- G11 - INFORMATION STORAGE
Information Patent Application
EMI SHIELD FOR MOLDED PACKAGES
- Publication number 20200303321
- Publication date Sep 24, 2020
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MODULE FOR SIP
- Publication number 20200243451
- Publication date Jul 30, 2020
- Octavo Systems LLC
- Gene Alan FRANTZ
- G11 - INFORMATION STORAGE
Information Patent Application
MIXED SIGNAL COMPUTER ARCHITECTURE
- Publication number 20200134268
- Publication date Apr 30, 2020
- Octavo Systems LLC
- Gene Alan Frantz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM IN A PACKAGE CONNECTORS
- Publication number 20200066702
- Publication date Feb 27, 2020
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC TEST EQUIPMENT METHOD FOR TESTING SYSTEM IN A PACKAGE DEV...
- Publication number 20200058364
- Publication date Feb 20, 2020
- Octavo Systems LLC
- Kevin Michael TROY
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR ROUTING BOND WIRES IN SYSTEM IN A PACKAGE (SIP) DEVICES
- Publication number 20190347378
- Publication date Nov 14, 2019
- Octavo Systems LLC
- Neeraj Kumar Reddy DANTU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVICE MODULE FOR SIP DEVICES
- Publication number 20190273073
- Publication date Sep 5, 2019
- Octavo Systems LLC
- Masood MURTUZA
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE FOR USE IN SYSTEM IN A PACKAGE (SIP) DEVICES
- Publication number 20190206779
- Publication date Jul 4, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR SYSTEM IN PACKAGING (SIP) DEVICES
- Publication number 20190115331
- Publication date Apr 18, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS
- Publication number 20190074268
- Publication date Mar 7, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELD FOR MOLDED PACKAGES
- Publication number 20190027443
- Publication date Jan 24, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
- Publication number 20180321313
- Publication date Nov 8, 2018
- Octavo Systems LLC
- Kevin Michael Troy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEM-IN-PACKAGE DEVICE BALL MAP AND LAYOUT OPTIMIZATION
- Publication number 20180317323
- Publication date Nov 1, 2018
- Octavo Systems LLC
- Erik James Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF PASSIVE COMPONENTS IN SYSTEM-IN-PACKAGE DEVICES
- Publication number 20180317316
- Publication date Nov 1, 2018
- Octavo Systems LLC
- Erik James Welsh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPROVED SUBSTRATE FOR SYSTEM IN PACKAGE (SIP) DEVICES
- Publication number 20170287885
- Publication date Oct 5, 2017
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20170221871
- Publication date Aug 3, 2017
- Octavo Systems LLC
- Gregory Michael Sheridan
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
87751565 - VO
- Serial number 87751565
- Registration number 5481200
- Filing date Jan 11, 2018
- Octavo Systems LLC
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
87657879 - C-SIP
- Serial number 87657879
- Registration number 5801162
- Filing date Oct 24, 2017
- Octavo Systems LLC
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
87030762 - OSD
- Serial number 87030762
- Filing date May 10, 2016
- Octavo Systems LLC
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
86632535 - OCTAVO
- Serial number 86632535
- Registration number 4999711
- Filing date May 18, 2015
- Octavo Systems LLC
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Octavo Systems LLC

Organization

Patents Grantslast 30 patents

Secure enclave system-in-package

System in a package modifications

High performance module for SiP

System and method of assembling a system

Component communications in system-in-package systems

Analog memory cells with valid flag

Analog arithmetic unit

Automatic test equipment method for testing system in a package dev...

Mixed signal computer architecture

EMI shield for molded packages

System in a package connectors

Service module for SIP devices

Configurable substrate and systems

Mixed signal computer

Method for routing bond wires in system in a package (SiP) devices

System-in-Package device ball map and layout optimization

Circuit mounting structure and lead frame for system in package (SI...

EMI shield for molded packages

Reduction of passive components in system-in-package devices

Substrate for system in package (SIP) devices

Patents Applicationslast 30 patents

SECURE ENCLAVE SYSTEM-IN-PACKAGE

SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT

SYSTEM IN A PACKAGE MODIFICATIONS

SECURE ENCLAVE SYSTEM-IN-PACKAGE

COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS

MOLDED PACKAGES IN A MOLDED DEVICE

SYSTEM IN A PACKAGE MODIFICATIONS

ANALOG ARITHMETIC UNIT

MIXED SIGNAL COMPUTER

ANALOG MEMORY CELLS WITH VALID FLAG

EMI SHIELD FOR MOLDED PACKAGES

HIGH PERFORMANCE MODULE FOR SIP

MIXED SIGNAL COMPUTER ARCHITECTURE

SYSTEM IN A PACKAGE CONNECTORS

AUTOMATIC TEST EQUIPMENT METHOD FOR TESTING SYSTEM IN A PACKAGE DEV...

METHOD FOR ROUTING BOND WIRES IN SYSTEM IN A PACKAGE (SIP) DEVICES

SERVICE MODULE FOR SIP DEVICES

SUBSTRATE FOR USE IN SYSTEM IN A PACKAGE (SIP) DEVICES

SUBSTRATE FOR SYSTEM IN PACKAGING (SIP) DEVICES

IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS

EMI SHIELD FOR MOLDED PACKAGES

COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS

SYSTEM-IN-PACKAGE DEVICE BALL MAP AND LAYOUT OPTIMIZATION

REDUCTION OF PASSIVE COMPONENTS IN SYSTEM-IN-PACKAGE DEVICES

IMPROVED SUBSTRATE FOR SYSTEM IN PACKAGE (SIP) DEVICES

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES

Trademarklast 30 trademarks

87751565 - VO

87657879 - C-SIP

87030762 - OSD

86632535 - OCTAVO