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CHAM, CH
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Patents Grants
last 30 patents
Information
Patent Grant
Method for picking up semiconductor chips from a wafer table and me...
Patent number
8,133,823
Issue date
Mar 13, 2012
Oerlikon Assembly Equipment AG, Steinhausen
Stefan Behler
G05 - CONTROLLING REGULATING
Information
Patent Grant
Method for mounting a flip chip on a substrate
Patent number
7,597,234
Issue date
Oct 6, 2009
Oerlikon Assembly Equipment AG, Steinhausen
Patrick Blessing
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patents Applications
last 30 patents
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Patent Application
WIRE SUPPLY DEVICE FOR A WIRE BONDER
Publication number
20100224715
Publication date
Sep 9, 2010
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Armin Felber
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Foil Perforating Needle For Detaching A Small Die From The Foil
Publication number
20090271978
Publication date
Nov 5, 2009
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Rene Josef Ulrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDER
Publication number
20090218385
Publication date
Sep 3, 2009
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Florian Faessler
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Pick-Up Tool And Method For Grasping And Mounting Small Dies
Publication number
20090144968
Publication date
Jun 11, 2009
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Rene Josef Ulrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method For Picking Up Semiconductor Chips From A Wafer Table And Me...
Publication number
20090098667
Publication date
Apr 16, 2009
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Stefan Behler
G05 - CONTROLLING REGULATING
Information
Patent Application
Pick And Place System For A Semiconductor Mounting Apparatus
Publication number
20090070992
Publication date
Mar 19, 2009
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Florentin Etter
B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information
Patent Application
Device For Pressing On Semiconductor Chips Arranged On A Substrate
Publication number
20080314264
Publication date
Dec 25, 2008
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Roland Kuster
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND HEAD FOR A WIRE BONDER
Publication number
20080308609
Publication date
Dec 18, 2008
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Armin Felber
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRE CLAMP FOR A WIRE BONDER
Publication number
20080302857
Publication date
Dec 11, 2008
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
Armin Felber
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR