ONANO INDUSTRIAL CORP

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TAIPEI CITY 114, TW

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
- Publication number 20230147337
- Publication date May 11, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
- Publication number 20230131658
- Publication date Apr 27, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
- Publication number 20230126956
- Publication date Apr 27, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE OF CIRCUIT MOLD UNIT OF LTCC ELECTRONIC DEVICE
- Publication number 20230070377
- Publication date Mar 9, 2023
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LTCC ELECTRONIC DEVICE UNIT STRUCTURE
- Publication number 20220367363
- Publication date Nov 17, 2022
- ONANO INDUSTRIAL CORP.
- Chun-Hsia Chen
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks