TREA

OPTIMUM CARE INTERNATIONAL TECH INC

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Organization

  • NEIHU DISTRICT, CN
Organizations

Patents Grantslast 30 patents

  • Information Patent Grant

    Chip package structure
    • Patent number 7,309,918
    • Issue date Dec 18, 2007
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Memory module
    • Patent number 7,215,540
    • Issue date May 8, 2007
    • Optimum Care International Tech. Inc.
    • Shih-Hsiung Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Manufacturing method of a modularized leadframe
    • Patent number 7,204,017
    • Issue date Apr 17, 2007
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Memory module
    • Patent number 7,145,779
    • Issue date Dec 5, 2006
    • Optimum Care International Tech.Inc.
    • Shih-Hsiung Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Concealable chip leadframe unit structure
    • Patent number 7,138,704
    • Issue date Nov 21, 2006
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Memory module
    • Patent number 7,119,436
    • Issue date Oct 10, 2006
    • Optimum Care International Tech. Inc.
    • Shih-Hsiung Lien
    • G11 - INFORMATION STORAGE
  • Information Patent Grant

    Packaging method for integrated circuits
    • Patent number 7,074,651
    • Issue date Jul 11, 2006
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Chip Assembly Structure With Cover
    • Publication number 20070275574
    • Publication date Nov 29, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Jeffrey Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FINE-SIZED CHIP PACKAGE STRUCTURE
    • Publication number 20070132111
    • Publication date Jun 14, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MEMORY WITH SELF-CONTAINED POWER SUPPLY
    • Publication number 20070113108
    • Publication date May 17, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Shih-Hsiung Lien
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    FLEXIBLE MEMORY MODULE
    • Publication number 20070096181
    • Publication date May 3, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Shih-Hsiung Lien
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    MEMORY ARRAY MODULE MOUNTING STRUCTURE
    • Publication number 20070007638
    • Publication date Jan 11, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Shih-Hsiung Lien
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUC...
    • Publication number 20070004093
    • Publication date Jan 4, 2007
    • OPTIMUM CARE INTERNATIONAL TECH. INC.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of forming precision leads on a chip-supporting leadframe
    • Publication number 20060051899
    • Publication date Mar 9, 2006
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip fixed structure
    • Publication number 20050224927
    • Publication date Oct 13, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Packaging method for integrated circuits
    • Publication number 20050227414
    • Publication date Oct 13, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    High density lead arrangement package structure
    • Publication number 20050184365
    • Publication date Aug 25, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Miniaturized chip scale package structure
    • Publication number 20050179119
    • Publication date Aug 18, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Concealable chip leadframe unit structure
    • Publication number 20050156290
    • Publication date Jul 21, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor chip leadframe module
    • Publication number 20050156289
    • Publication date Jul 21, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Manufacturing method of a modularized leadframe
    • Publication number 20050125999
    • Publication date Jun 16, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit board having deposit holes
    • Publication number 20050121224
    • Publication date Jun 9, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Switching media for chip carrier device
    • Publication number 20050116325
    • Publication date Jun 2, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip assembling structure and socket
    • Publication number 20050115062
    • Publication date Jun 2, 2005
    • Optimum Care International Tech. Inc.
    • Jeffery Lien
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Assembly structure for hiding electronic components
    • Publication number 20050117314
    • Publication date Jun 2, 2005
    • Optimum Care International Tech. Inc.
    • Jeffrey Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Trademarklast 30 trademarks

  • Information Trademark

    77074782 - ENTASIS
    • Serial number 77074782
    • Registration number 3478729
    • Filing date Jan 3, 2007
    • Optimum Care International Tech. Inc.
    • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • Information Trademark

    77074783 - KINGBRIDGE
    • Serial number 77074783
    • Registration number 3478730
    • Filing date Jan 3, 2007
    • Optimum Care International Tech. Inc.
    • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments