OptoPac, Inc.

Organization

Seoul, KR

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip packaging of a photo-sensor die on a transparent substrate
- Patent number 7,494,848
- Issue date Feb 24, 2009
- Optopac, Inc.
- Deok-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for image sensor, and the packaging method thereof
- Patent number 7,384,818
- Issue date Jun 10, 2008
- OptoPac, Inc.
- Deok-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package of photo-image sensors in cellular phone camera...
- Patent number 7,291,518
- Issue date Nov 6, 2007
- Optopac, Inc.
- Deok-Hoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package for image sensor, and the packaging method thereof
- Patent number 7,141,869
- Issue date Nov 28, 2006
- OptoPac, Inc.
- Deok-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having a sealing structure on predetermined area...
- Patent number 7,122,874
- Issue date Oct 17, 2006
- Optopac, Inc.
- Deok-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package of photo-sensing semiconductor devices, and the...
- Patent number 7,038,287
- Issue date May 2, 2006
- OptoPac, Inc.
- Deok Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package of photo-image sensors in cellular phone camera...
- Patent number 6,943,423
- Issue date Sep 13, 2005
- Optopac, Inc.
- Deok-Hoon Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package having a patterned layer on backside of its subs...
- Patent number 6,943,424
- Issue date Sep 13, 2005
- Optopac, Inc.
- Deok-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package of photo-sensing semiconductor devices, and the...
- Patent number 6,864,116
- Issue date Mar 8, 2005
- OptoPac, Inc.
- Deok Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

OptoPac, Inc.

Organization

Patents Grantslast 30 patents

Flip-chip packaging of a photo-sensor die on a transparent substrate

Electronic package for image sensor, and the packaging method thereof

Electronic package of photo-image sensors in cellular phone camera...

Electronic package for image sensor, and the packaging method thereof

Electronic package having a sealing structure on predetermined area...

Electronic package of photo-sensing semiconductor devices, and the...

Electronic package of photo-image sensors in cellular phone camera...

Electronic package having a patterned layer on backside of its subs...

Electronic package of photo-sensing semiconductor devices, and the...

Patents Applicationslast 30 patents

Trademarklast 30 trademarks