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Patent Grant
Method for device packaging
Patent number
9,120,169
Issue date
Sep 1, 2015
ORION SYSTEMS INTEGRATION PTE LTD
Hwee Seng Chew
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING
Publication number
20140154037
Publication date
Jun 5, 2014
ORION SYSTEMS INTEGRATION PTE LTD
Amlan Sen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
Publication number
20110287560
Publication date
Nov 24, 2011
ORION SYSTEMS INTEGRATION PTE LTD
Hwee Seng Chew
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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