Oshika Shinko Co., Ltd.

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resorcinol resin adhesive composition
- Patent number 5,459,207
- Issue date Oct 17, 1995
- Oshika Shinko Co., Ltd.
- Yuki Saigan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for preparing resin-reinforced decorative board
- Patent number 5,405,705
- Issue date Apr 11, 1995
- Oshika Shinko Co., Ltd.
- Masaru Fujimoto
- B44 - DECORATIVE ARTS
Information Patent Grant
Adhesive composition for wood
- Patent number 5,223,587
- Issue date Jun 29, 1993
- Oshika Shinko Co. Ltd.
- Natsuhi Tsuruta
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition
- Patent number 5,200,458
- Issue date Apr 6, 1993
- Oshika Shinko Co., Ltd.
- Masaharu Iwasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Urea-formaldehyde resin adhesive
- Patent number 4,307,206
- Issue date Dec 22, 1981
- Oshika Shinko Co., Ltd.
- Mitsuo Higuchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

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