Packard Hughes Interconnect Company

Organization

Irvine, CA, US

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Stress relief bend useful in an integrated circuit redistribution p...
- Patent number 6,313,402
- Issue date Nov 6, 2001
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale burn-in socket
- Patent number 6,303,988
- Issue date Oct 16, 2001
- Packard Hughes Interconnect Company
- William R. Crumly
- G01 - MEASURING TESTING
Information Patent Grant
Bumps with plural under-bump dielectric layers
- Patent number 6,166,333
- Issue date Dec 26, 2000
- Packard Hughes Interconnect Company
- William R. Crumly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Snap lock connector for optical fiber systems
- Patent number 6,152,608
- Issue date Nov 28, 2000
- Packard Hughes Interconnect Company
- Mehrad Ghara
- G02 - OPTICS
Information Patent Grant
Arrowhead retention feature for a terminal pin
- Patent number 6,149,471
- Issue date Nov 21, 2000
- General Motors Corporation
- Adam M. Kemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a flexible circuit with raised features protruding...
- Patent number 6,085,414
- Issue date Jul 11, 2000
- Packard Hughes Interconnect Company
- David Bryan Swarbrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board to flexible printed circuit connection system
- Patent number 6,033,234
- Issue date Mar 7, 2000
- Packard Hughes Interconnect Company
- Terry Shing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer to layer interconnect
- Patent number 6,007,669
- Issue date Dec 28, 1999
- Packard Hughes Interconnect Company
- William R. Crumly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bussplate
- Patent number 6,007,351
- Issue date Dec 28, 1999
- Packard Hughes Interconnect Company
- Ronald E. Gabrisko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Membrane test probe
- Patent number 5,990,695
- Issue date Nov 23, 1999
- Packard Hughes Interconnect Co.
- Robert Earl Daugherty
- G01 - MEASURING TESTING
Information Patent Grant
Creating surface topography on an electrostatic chuck with a mandrel
- Patent number 5,986,873
- Issue date Nov 16, 1999
- Packard Hughes Interconnect Co.
- Randy Lee Thomas
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Solderless electrical connector
- Patent number 5,971,773
- Issue date Oct 26, 1999
- Packard Hughes Interconnect Company
- Douglas Edward Riddle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile clamping mechanism for connecting a printed circuit boa...
- Patent number 5,971,772
- Issue date Oct 26, 1999
- Packard Hughes Interconnect Company
- Terry Shing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level decal for minimal packaging of chips
- Patent number 5,946,555
- Issue date Aug 31, 1999
- Packard Hughes Interconnect Company
- William R. Crumly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector system with pre-staged feature
- Patent number 5,934,926
- Issue date Aug 10, 1999
- Packard Hughes Interconnect Company
- Ronald E. Gabrisko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making mandrels and circuits therefrom
- Patent number 5,924,193
- Issue date Jul 20, 1999
- Packard Hughes Interconnect Company
- William R. Crumly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with a chip on dot and a heat sink
- Patent number 5,896,271
- Issue date Apr 20, 1999
- Packard Hughes Interconnect Company
- Eric Dean Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch having raised contact features and a deflectable substrate
- Patent number 5,856,641
- Issue date Jan 5, 1999
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making contact pad having metallically anchored elastomer...
- Patent number 5,855,063
- Issue date Jan 5, 1999
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four position two dome switch
- Patent number 5,834,716
- Issue date Nov 10, 1998
- Packard Hughes Interconnect Company
- James Sungioun Lee
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Two-position latching two dome switch
- Patent number 5,819,916
- Issue date Oct 13, 1998
- Packard Hughes Interconnect Company
- James Sungioun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power clip-on interconnection system
- Patent number 5,788,543
- Issue date Aug 4, 1998
- Packard Hughes Interconnect Company
- Edward Rudoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral copper column with solder bump flip chip
- Patent number 5,790,377
- Issue date Aug 4, 1998
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for testing integrated circuit chips during vibration
- Patent number 5,777,484
- Issue date Jul 7, 1998
- Packard Hughes Interconnect Company
- Blake F. Woith
- G01 - MEASURING TESTING
Information Patent Grant
Method of making circuit with conductive and non-conductive raised...
- Patent number 5,762,845
- Issue date Jun 9, 1998
- Packard Hughes Interconnect Company
- William R. Crumly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad having metallically anchored elastomeric electrical con...
- Patent number 5,738,530
- Issue date Apr 14, 1998
- Packard Hughes Interconnect Company
- Chris M. Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for multiple dome dual detent
- Patent number 5,719,361
- Issue date Feb 17, 1998
- Packard Hughes Interconnect Company
- James Sungioun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latching switch
- Patent number 5,714,732
- Issue date Feb 3, 1998
- Packard Hughes Interconnect Company
- James Sungioun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Puncture-resistant electrostatic chuck with flat surface and method...
- Patent number 5,708,557
- Issue date Jan 13, 1998
- Packard Hughes Interconnect Company
- Haim Feigenbaum
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sharp angle fiber optic interconnection system
- Patent number 5,682,449
- Issue date Oct 28, 1997
- Packard Hughes Interconnect Company
- Laurie Keiko Taira-Griffin
- G02 - OPTICS

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
75054739 - GOLD DOT
- Serial number 75054739
- Filing date Feb 7, 1996
- PACKARD HUGHES INTERCONNECT
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
74572771 - CHIPSTACK
- Serial number 74572771
- Registration number 1921724
- Filing date Sep 14, 1994
- PACKARD HUGHES INTERCONNECT
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Packard Hughes Interconnect Company

Organization

Patents Grantslast 30 patents

Stress relief bend useful in an integrated circuit redistribution p...

Wafer scale burn-in socket

Bumps with plural under-bump dielectric layers

Snap lock connector for optical fiber systems

Arrowhead retention feature for a terminal pin

Method of making a flexible circuit with raised features protruding...

Printed circuit board to flexible printed circuit connection system

Layer to layer interconnect

Bussplate

Membrane test probe

Creating surface topography on an electrostatic chuck with a mandrel

Solderless electrical connector

Low profile clamping mechanism for connecting a printed circuit boa...

Wafer level decal for minimal packaging of chips

Electrical connector system with pre-staged feature

Method of making mandrels and circuits therefrom

Integrated circuit with a chip on dot and a heat sink

Switch having raised contact features and a deflectable substrate

Method of making contact pad having metallically anchored elastomer...

Four position two dome switch

Two-position latching two dome switch

High power clip-on interconnection system

Integral copper column with solder bump flip chip

Device for testing integrated circuit chips during vibration

Method of making circuit with conductive and non-conductive raised...

Contact pad having metallically anchored elastomeric electrical con...

Mechanism for multiple dome dual detent

Latching switch

Puncture-resistant electrostatic chuck with flat surface and method...

Sharp angle fiber optic interconnection system

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

75054739 - GOLD DOT

74572771 - CHIPSTACK