PELNOX CO., LTD.

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Hadano-shi, Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Chip-shaped electronic component
- Patent number 11,081,263
- Issue date Aug 3, 2021
- PELNOX, LTD.
- Eiji Iwamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating coating composition and heat dissipating coating film
- Patent number 9,346,993
- Issue date May 24, 2016
- Arakawa Chemical Industries, Ltd.
- Eiji Iwamura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SHAPED ELECTRONIC COMPONENT
- Publication number 20200126695
- Publication date Apr 23, 2020
- PELNOX, LTD.
- Eiji IWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSAPATING POWDER COATING COMPOSITION, HEAT-DISSIPATING COATI...
- Publication number 20160024366
- Publication date Jan 28, 2016
- PELNOX, LTD.
- Eiji IWAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT DISSIPATING COATING COMPOSITION AND HEAT DISSIPATING COATING FILM
- Publication number 20150010759
- Publication date Jan 8, 2015
- ARAKAWA CHEMICAL INDUSTRIES, LTD
- Eiji Iwamura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Trademarklast 30 trademarks