PFG IP LLC

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San Francisco, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,741,680
- Issue date Aug 22, 2017
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap chip and reroute layer for stacked microelectronic module
- Patent number 9,728,507
- Issue date Aug 8, 2017
- PFG IP LLC
- Sambo He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,431,275
- Issue date Aug 30, 2016
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor system comprising stacked micro-channel plate detector
- Patent number 9,142,380
- Issue date Sep 22, 2015
- PFG IP LLC
- Medhet Azzazy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked micro-channel plate assembly comprising a micro-lens
- Patent number 9,129,780
- Issue date Sep 8, 2015
- PFG IP LLC
- Medhat Azzazy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state drive memory device comprising secure erase function
- Patent number 9,111,621
- Issue date Aug 18, 2015
- PFG IP LLC
- Christian Krutzik
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-calibrating targeting sight
- Patent number 9,046,322
- Issue date Jun 2, 2015
- PFG IP LLC
- James Justice
- F41 - WEAPONS

Patents Applicationslast 30 patents

Trademarklast 30 trademarks