PHOENIX & CORPORATION

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GRAND CAYMAN, KY

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package having heat dissipating element and method for f...
- Patent number 10,896,882
- Issue date Jan 19, 2021
- PHOENIX & CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated driving module with energy conversion function and manuf...
- Patent number 10,707,000
- Issue date Jul 7, 2020
- PHOENIX & CORPORATION
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and associated fabrication method with varying de...
- Patent number 10,580,739
- Issue date Mar 3, 2020
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and its fabrication method
- Patent number 10,361,160
- Issue date Jul 23, 2019
- PHOENIX & CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and its fabrication method
- Patent number 10,304,750
- Issue date May 28, 2019
- PHOENIX & CORPORATION
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method of manufacturing the same
- Patent number 10,269,841
- Issue date Apr 23, 2019
- PHOENIX & CORPORATION
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having a plurality of chips electrically connecte...
- Patent number 10,079,220
- Issue date Sep 18, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate
- Patent number 10,062,649
- Issue date Aug 28, 2018
- PHOENIX & CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method of fabricating the same
- Patent number 10,002,823
- Issue date Jun 19, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 9,941,208
- Issue date Apr 10, 2018
- PHOENIX & CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200305289
- Publication date Sep 24, 2020
- PHOENIX & CORPORATION
- Chun-Hsien Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUF...
- Publication number 20200279683
- Publication date Sep 3, 2020
- PHOENIX & CORPORATION
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200075554
- Publication date Mar 5, 2020
- PHOENIX & CORPORATION
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD...
- Publication number 20200075565
- Publication date Mar 5, 2020
- PHOENIX & CORPORATION
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUF...
- Publication number 20200075211
- Publication date Mar 5, 2020
- PHOENIX & CORPORATION
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190214349
- Publication date Jul 11, 2019
- PHOENIX & CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190206754
- Publication date Jul 4, 2019
- PHOENIX & CORPORATION
- Che-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Sensor Package and Method of Manufacturing the Same
- Publication number 20190103429
- Publication date Apr 4, 2019
- PHOENIX & CORPORATION
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND ITS FABRICATION METHOD
- Publication number 20190067140
- Publication date Feb 28, 2019
- PHOENIX & CORPORATION
- CHE-WEI HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240747
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240748
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS

PHOENIX & CORPORATION

Organization

Patents Grantslast 30 patents

Electronic package having heat dissipating element and method for f...

Integrated driving module with energy conversion function and manuf...

Package substrate and associated fabrication method with varying de...

Package structure and its fabrication method

Package structure and its fabrication method

Sensor package and method of manufacturing the same

Package substrate having a plurality of chips electrically connecte...

Package substrate

Packaging substrate and method of fabricating the same

Substrate structure and manufacturing method thereof

Patents Applicationslast 30 patents

FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUF...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD...

INTEGRATED DRIVING MODULE WITH ENERGY CONVERSION FUNCTION AND MANUF...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

Sensor Package and Method of Manufacturing the Same

PACKAGE STRUCTURE AND ITS FABRICATION METHOD

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

Trademarklast 30 trademarks