PHOENIX SILICON INTERNATIONAL CORPORATION

Organization

  • HSINCHU, TW

Patents Grantslast 30 patents

  • Information Patent Grant

    Taiko wafer ring cut process method

    • Patent number 11,551,923
    • Issue date Jan 10, 2023
    • PHOENIX SILICON INTERNATIONAL CORP.
    • Chien-Hsiung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing process of wafer thinning

    • Patent number 10,026,603
    • Issue date Jul 17, 2018
    • PHOENIX SILICON INTERNATIONAL CORP.
    • Shih-Ching Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Intelligent power saving system

    • Patent number 8,489,249
    • Issue date Jul 16, 2013
    • Phoenix Silicon International Corporation
    • Chin-Chou Chen
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Coating layer removing apparatus and method for the same

    • Patent number 8,309,880
    • Issue date Nov 13, 2012
    • Phoenix Silicon International Corporation
    • I-Feng Chung
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

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