Powertech Technology (Suzhou) Ltd.

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Suzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package and method for manufacturing the same
- Patent number 12,154,863
- Issue date Nov 26, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-middle type fan-out panel-level package and packaging method t...
- Patent number 12,094,809
- Issue date Sep 17, 2024
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,990,494
- Issue date May 21, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,916,035
- Issue date Feb 27, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,848,318
- Issue date Dec 19, 2023
- Powertech Technology Inc.
- Pei-Hsun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,769,763
- Issue date Sep 26, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test head assembly for semiconductor device
- Patent number 11,693,043
- Issue date Jul 4, 2023
- Powertech Technology Inc.
- Ying-Tang Chao
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package
- Patent number 11,694,950
- Issue date Jul 4, 2023
- Powertech Technology Inc.
- Chih-Yen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor with dam structure and method for manufacturing the same
- Patent number 11,676,983
- Issue date Jun 13, 2023
- Powertech Technology Inc.
- Chung-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising plurality of bumps and fabricating...
- Patent number 11,670,611
- Issue date Jun 6, 2023
- Powertech Technology Inc.
- Shang-Yu Chang-Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and packaging method thereof
- Patent number 11,670,622
- Issue date Jun 6, 2023
- Powertech Technology Inc.
- Yin-Huang Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure
- Patent number 11,658,084
- Issue date May 23, 2023
- Powertech Technology Inc.
- Shun-Ming Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure with back-deposited shielding lay...
- Patent number 11,658,046
- Issue date May 23, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including multiple dies surrounded by conductive...
- Patent number 11,637,071
- Issue date Apr 25, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head of a tag device
- Patent number 11,608,205
- Issue date Mar 21, 2023
- Powertech Technology Inc.
- Ching-Chia Yang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Chip carrier device
- Patent number 11,587,808
- Issue date Feb 21, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure having a first connection circuit and manufacturi...
- Patent number 11,569,210
- Issue date Jan 31, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,557,533
- Issue date Jan 17, 2023
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,545,423
- Issue date Jan 3, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,545,424
- Issue date Jan 3, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna package structure and manufacturing method thereof
- Patent number 11,532,575
- Issue date Dec 20, 2022
- Powertech Technology Inc.
- Han-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 11,522,000
- Issue date Dec 6, 2022
- Powertech Technology Inc.
- Hung-Hsin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package method of a modular stacked semiconductor package
- Patent number 11,488,946
- Issue date Nov 1, 2022
- Powertech Technology Inc.
- Yi-hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 11,456,243
- Issue date Sep 27, 2022
- Powertech Technology Inc.
- Nan-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with landing pads and manufacturing...
- Patent number 11,437,336
- Issue date Sep 6, 2022
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having partial outer metal layer and packagin...
- Patent number 11,410,945
- Issue date Aug 9, 2022
- Powertech Technology Inc.
- Shih-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer storage device, carrier plate and wafer cassette
- Patent number 11,367,641
- Issue date Jun 21, 2022
- Powertech Technology Inc.
- Chin-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,367,678
- Issue date Jun 21, 2022
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure of the semiconductor package
- Patent number 11,362,055
- Issue date Jun 14, 2022
- Powertech Technology Inc.
- Chih-Yen Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20250040276
- Publication date Jan 30, 2025
- Powertech Technology Inc.
- Hung-Hsin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371785
- Publication date Nov 7, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240347348
- Publication date Oct 17, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240347438
- Publication date Oct 17, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240339443
- Publication date Oct 10, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240313024
- Publication date Sep 19, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240297190
- Publication date Sep 5, 2024
- Powertech Technology Inc.
- CHING-CHAO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274566
- Publication date Aug 15, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240162260
- Publication date May 16, 2024
- Powertech Technology Inc.
- Shao Chieh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030198
- Publication date Jan 25, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030121
- Publication date Jan 25, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021640
- Publication date Jan 18, 2024
- POWERTECH TECHNOLOGY INC.
- Ching-Wei LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021595
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF
- Publication number 20240021558
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE WITH LOW LIGHT-SENSING NOISE
- Publication number 20240021637
- Publication date Jan 18, 2024
- Powertech Technology Inc.
- Wei-Lun HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE OF IMAGE SENSING DEVICE AND MANUFACTURING...
- Publication number 20230411419
- Publication date Dec 21, 2023
- Powertech Technology Inc.
- Ching-Chao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290730
- Publication date Sep 14, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282587
- Publication date Sep 7, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230223311
- Publication date Jul 13, 2023
- Powertech Technology Inc.
- Kun-Yung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-MIDDLE TYPE FAN-OUT PANEL-LEVEL PACKAGE AND PACKAGING METHOD T...
- Publication number 20230207434
- Publication date Jun 29, 2023
- Powertech Technology Inc.
- Hiroyuki FUJISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197647
- Publication date Jun 22, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230110079
- Publication date Apr 13, 2023
- Powertech Technology Inc.
- Pei-chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST HEAD ASSEMBLY FOR SEMICONDUCTOR DEVICE
- Publication number 20220334168
- Publication date Oct 20, 2022
- Powertech Technology Inc.
- Ying-Tang CHAO
- G01 - MEASURING TESTING
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220328422
- Publication date Oct 13, 2022
- Powertech Technology Inc.
- Shang-Yu CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220320052
- Publication date Oct 6, 2022
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220320063
- Publication date Oct 6, 2022
- Powertech Technology Inc.
- Pei-Hsun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20220302061
- Publication date Sep 22, 2022
- Powertech Technology Inc.
- Shang-Yu CHANG-CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220173051
- Publication date Jun 2, 2022
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF
- Publication number 20220165709
- Publication date May 26, 2022
- Powertech Technology Inc.
- Yin-Huang KUNG
- H01 - BASIC ELECTRIC ELEMENTS

Powertech Technology (Suzhou) Ltd.

Organization

Patents Grantslast 30 patents

Fan-out semiconductor package and method for manufacturing the same

Chip-middle type fan-out panel-level package and packaging method t...

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Test head assembly for semiconductor device

Semiconductor package

Sensor with dam structure and method for manufacturing the same

Semiconductor package comprising plurality of bumps and fabricating...

Stacked semiconductor package and packaging method thereof

Semiconductor packaging structure

Semiconductor packaging structure with back-deposited shielding lay...

Package structure including multiple dies surrounded by conductive...

Head of a tag device

Chip carrier device

Package structure having a first connection circuit and manufacturi...

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Integrated antenna package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Package method of a modular stacked semiconductor package

Semiconductor package structure and manufacturing method thereof

Semiconductor package structure with landing pads and manufacturing...

Semiconductor package having partial outer metal layer and packagin...

Wafer storage device, carrier plate and wafer cassette

Package structure and manufacturing method thereof

Bump structure of the semiconductor package

Patents Applicationslast 30 patents

IMAGE SENSOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP STRUCTURE, SEMICONDUCTOR PACKAGE, AND FABRICATING METHOD THEREOF

IMAGE SENSOR PACKAGE WITH LOW LIGHT-SENSING NOISE

FAN-OUT PACKAGE STRUCTURE OF IMAGE SENSING DEVICE AND MANUFACTURING...

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGING ASSEMBLY AND SEMICONDUCTOR PACKAGING STRUCTURE

CHIP-MIDDLE TYPE FAN-OUT PANEL-LEVEL PACKAGE AND PACKAGING METHOD T...

INTEGRATED ANTENNA PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

TEST HEAD ASSEMBLY FOR SEMICONDUCTOR DEVICE

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF

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