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Qi Ding Technology Qinhuangdao Co., Ltd.

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  • Qinhuangdao, CN
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGED CIRCUIT STRUCTURE
    • Publication number 20230232537
    • Publication date Jul 20, 2023
    • Leading Interconnect Semiconductor Technology Qinhuangdao Co., Ltd.
    • CHUN-CHIEH HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20220240385
    • Publication date Jul 28, 2022
    • Qi Ding Technology Qinhuangdao Co., Ltd.
    • CHUN-CHIEH HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD
    • Publication number 20200163229
    • Publication date May 21, 2020
    • Qi Ding Technology Qinhuangdao Co., Ltd.
    • SHIH-FU HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITON, REMOVABLE ADHESIVE LAYER, IC SUBSTRATE, AND IC PA...
    • Publication number 20190352548
    • Publication date Nov 21, 2019
    • Qi Ding Technology Qinhuangdao Co., Ltd.
    • KUO-SHENG LIANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE
    • Publication number 20180235085
    • Publication date Aug 16, 2018
    • Qi Ding Technology Qinhuangdao Co., Ltd.
    • YU-CHENG HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20170365540
    • Publication date Dec 21, 2017
    • Qi Ding Technology Qinhuangdao Co., Ltd.
    • WEI-SHUO SU
    • H01 - BASIC ELECTRIC ELEMENTS