QMAT, Inc.

Organization

San Jose, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Seed wafer for GaN thickening using gas- or liquid-phase epitaxy
- Patent number 10,186,630
- Issue date Jan 22, 2019
- QMAT, INC.
- Francois J. Henley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond and release layer transfer process
- Patent number 10,164,144
- Issue date Dec 25, 2018
- QMAT, INC.
- Francois J. Henley
- C30 - CRYSTAL GROWTH
Information Patent Grant
Techniques for forming optoelectronic devices
- Patent number 10,041,187
- Issue date Aug 7, 2018
- QMAT, INC.
- Francois J. Henley
- C30 - CRYSTAL GROWTH
Information Patent Grant
Bond and release layer transfer process
- Patent number 9,859,458
- Issue date Jan 2, 2018
- QMAT, INC.
- Francois J. Henley
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
SEED WAFER FOR GaN THICKENING USING GAS- OR LIQUID-PHASE EPITAXY
- Publication number 20190288158
- Publication date Sep 19, 2019
- QMAT, Inc.
- Francois J. HENLEY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOND AND RELEASE LAYER TRANSFER PROCESS
- Publication number 20190103507
- Publication date Apr 4, 2019
- QMAT, Inc.
- Francois J. HENLEY
- C30 - CRYSTAL GROWTH
Information Patent Application
TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES
- Publication number 20190024259
- Publication date Jan 24, 2019
- QMAT, Inc.
- Francois J. HENLEY
- C30 - CRYSTAL GROWTH
Information Patent Application
MICRO-LIGHT EMITTING DIODE (LED) FABRICATION BY LAYER TRANSFER
- Publication number 20180138357
- Publication date May 17, 2018
- QMAT, Inc.
- Francois J. HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEED WAFER FOR GaN THICKENING USING GAS- OR LIQUID-PHASE EPITAXY
- Publication number 20180040764
- Publication date Feb 8, 2018
- QMAT, Inc.
- Francois J. HENLEY
- C30 - CRYSTAL GROWTH
Information Patent Application
BOND AND RELEASE LAYER TRANSFER PROCESS
- Publication number 20180040765
- Publication date Feb 8, 2018
- QMAT, Inc.
- Francois J. HENLEY
- C30 - CRYSTAL GROWTH
Information Patent Application
REMOVAL OF NON-CLEAVED/NON-TRANSFERRED MATERIAL FROM DONOR SUBSTRATE
- Publication number 20180033609
- Publication date Feb 1, 2018
- QMAT, Inc.
- Francois J. HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAM...
- Publication number 20180019169
- Publication date Jan 18, 2018
- QMAT, Inc.
- Francois J. HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND AND RELEASE LAYER TRANSFER PROCESS
- Publication number 20160372628
- Publication date Dec 22, 2016
- QMAT, Inc.
- Francois J. HENLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES
- Publication number 20140197419
- Publication date Jul 17, 2014
- QMAT, Inc.
- Francois J. HENLEY
- C30 - CRYSTAL GROWTH

Organization

Patents Grantslast 30 patents

Seed wafer for GaN thickening using gas- or liquid-phase epitaxy

Bond and release layer transfer process

Techniques for forming optoelectronic devices

Bond and release layer transfer process

Patents Applicationslast 30 patents

SEED WAFER FOR GaN THICKENING USING GAS- OR LIQUID-PHASE EPITAXY

BOND AND RELEASE LAYER TRANSFER PROCESS

TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES

MICRO-LIGHT EMITTING DIODE (LED) FABRICATION BY LAYER TRANSFER

SEED WAFER FOR GaN THICKENING USING GAS- OR LIQUID-PHASE EPITAXY

BOND AND RELEASE LAYER TRANSFER PROCESS

REMOVAL OF NON-CLEAVED/NON-TRANSFERRED MATERIAL FROM DONOR SUBSTRATE

BACKING SUBSTRATE STABILIZING DONOR SUBSTRATE FOR IMPLANT OR RECLAM...

BOND AND RELEASE LAYER TRANSFER PROCESS

TECHNIQUES FOR FORMING OPTOELECTRONIC DEVICES

Trademarklast 30 trademarks