QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.

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Quanzhou City, CN

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250210477
- Publication date Jun 26, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
- Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC WAFER AND METHOD OF FABRICATING THE SAME AND ACOUSTIC...
- Publication number 20250211196
- Publication date Jun 26, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
- Minghui FANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELASTIC WAVE DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC M...
- Publication number 20250211200
- Publication date Jun 26, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
- Yenfu LIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUPPORT LAYER SUBSTRATE, COMPOSITE SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20250202451
- Publication date Jun 19, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO.,LTD.
- Minghui FANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118700
- Publication date Apr 10, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO.,LTD.
- Xiaopeng GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND ACOUSTIC WAVE DEVICE
- Publication number 20240388274
- Publication date Nov 21, 2024
- QUANZHOU SANAN INTEGRATED CIRCUIT CO.,LTD.
- Zhonghe LIN
- H03 - BASIC ELECTRONIC CIRCUITRY

QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.

Organization

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING STRUCTURE

PIEZOELECTRIC WAFER AND METHOD OF FABRICATING THE SAME AND ACOUSTIC...

ELASTIC WAVE DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC M...

SUPPORT LAYER SUBSTRATE, COMPOSITE SUBSTRATE, AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BONDING STRUCTURE AND ACOUSTIC WAVE DEVICE