QUBEICON LTD.

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Rishon LeZion, IL

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die and package jigsaw submount
- Patent number 9,831,144
- Issue date Nov 28, 2017
- QUBEICON LTD.
- Shimon Podval
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT
- Publication number 20160163610
- Publication date Jun 9, 2016
- QUBEICON LTD.
- Shimon Podval
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks