RJR Polymers, Inc.

Organization

Oakland, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Modular low stress package technology
- Patent number 8,759,965
- Issue date Jun 24, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,639,373
- Issue date Jan 28, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,560,104
- Issue date Oct 15, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of diverse materials in air-cavity packaging of electronic devices
- Patent number 6,511,866
- Issue date Jan 28, 2003
- RJR Polymers, Inc.
- Raymond S. Bregante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame moisture barrier for molded plastic electronic packages
- Patent number 6,214,152
- Issue date Apr 10, 2001
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted stamping process
- Patent number 5,816,158
- Issue date Oct 6, 1998
- RJR Polymers, Inc.
- Richard J. Ross
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of assembling integrated circuit package
- Patent number 5,706,579
- Issue date Jan 13, 1998
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with heat dissipation for high current...
- Patent number 5,572,070
- Issue date Nov 5, 1996
- RJR Polymers, Inc.
- Richard J. Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iso-thermal seal process for electronic devices
- Patent number 5,056,296
- Issue date Oct 15, 1991
- R. J. R. Polymers, Inc.
- Richard J. Ross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110086469
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087356
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084371
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084376
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087353
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF DIVERSE MATERIALS IN AIR-CAVITY PACKAGING OF ELECTRONIC DEVICES
- Publication number 20030013234
- Publication date Jan 16, 2003
- RJR Polymers, Inc.
- Raymond S. Bregante
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
85052811 - R PAK
- Serial number 85052811
- Registration number 4126090
- Filing date Jun 2, 2010
- RJR POLYMERS, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76015147 - THE TOTAL ELECTRONIC PACKAGE SOLUTION
- Serial number 76015147
- Registration number 2529221
- Filing date Mar 30, 2000
- RJR POLYMERS, INC.
- 35 - Advertising
Information Trademark
75567919 - QUIKBOND
- Serial number 75567919
- Registration number 2493053
- Filing date Oct 8, 1998
- RJR POLYMERS, INC.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
75512915
- Serial number 75512915
- Registration number 2423783
- Filing date Jul 2, 1998
- RJR POLYMERS, INC.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
75344315 - R PAK
- Serial number 75344315
- Registration number 2275296
- Filing date Aug 18, 1997
- RJR POLYMERS, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

RJR Polymers, Inc.

Organization

Patents Grantslast 30 patents

Modular low stress package technology

Modular low stress package technology

Modular low stress package technology

Use of diverse materials in air-cavity packaging of electronic devices

Lead frame moisture barrier for molded plastic electronic packages

Inverted stamping process

Method of assembling integrated circuit package

Integrated circuit packages with heat dissipation for high current...

Iso-thermal seal process for electronic devices

Patents Applicationslast 30 patents

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

MODULAR LOW STRESS PACKAGE TECHNOLOGY

USE OF DIVERSE MATERIALS IN AIR-CAVITY PACKAGING OF ELECTRONIC DEVICES

Trademarklast 30 trademarks

85052811 - R PAK

76015147 - THE TOTAL ELECTRONIC PACKAGE SOLUTION

75567919 - QUIKBOND

75512915

75344315 - R PAK