s3c inc.

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new York, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Smart diagnosis and protection circuits for ASIC wiring fault condi...
- Patent number 9,054,517
- Issue date Jun 9, 2015
- S3C, Inc.
- Zhineng Zhu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Submersible electronic sensor
- Patent number 8,887,576
- Issue date Nov 18, 2014
- S3C, Inc.
- Joe Castagna
- G01 - MEASURING TESTING
Information Patent Grant
Mechanical packaging technique of attaching MEMS and flex circuit
- Patent number 8,806,925
- Issue date Aug 19, 2014
- S3C, Inc.
- Ihioma U. Nzeadibe
- G01 - MEASURING TESTING
Information Patent Grant
Sensor device packaging
- Patent number 8,643,127
- Issue date Feb 4, 2014
- S3C, Inc.
- John Dangtran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Media-compatible electrically isolated pressure sensor for high tem...
- Patent number 8,627,559
- Issue date Jan 14, 2014
- S3C, Inc.
- James Tjanmeng Suminto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Media-compatible electrically isolated pressure sensor for high tem...
- Patent number 8,316,533
- Issue date Nov 27, 2012
- S3C, Inc.
- James Tjanmeng Suminto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Temperature compensated RC oscillator for signal conditioning ASIC...
- Patent number 8,044,740
- Issue date Oct 25, 2011
- S3C, Inc.
- Zhineng Zhu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Media-compatible electrically isolated pressure sensor for high tem...
- Patent number 7,775,119
- Issue date Aug 17, 2010
- S3C, Inc.
- James Tjanmeng Suminto
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR MINIMIZING DEFLECTION OF A MEMBRANCE OF AN AB...
- Publication number 20130214370
- Publication date Aug 22, 2013
- S3C, Inc.
- Javed Hussain
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEDIA-COMPATIBLE ELECTRICALLY ISOLATED PRESSURE SENSOR FOR HIGH TEM...
- Publication number 20130137207
- Publication date May 30, 2013
- S3C, Inc.
- James Tjanmeng Suminto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER
- Publication number 20130130424
- Publication date May 23, 2013
- S3C, Inc.
- Roger Horton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT
- Publication number 20130125634
- Publication date May 23, 2013
- S3C, Inc.
- Ihioma U. NZEADIBE
- G01 - MEASURING TESTING
Information Patent Application
SUBMERSIBLE ELECTRONIC SENSOR
- Publication number 20130118266
- Publication date May 16, 2013
- S3C, Inc.
- Joe CASTAGNA
- G01 - MEASURING TESTING
Information Patent Application
TEMPERATURE COMPENSATED RC OSCILLATOR FOR SIGNAL CONDITIONING ASIC...
- Publication number 20110050353
- Publication date Mar 3, 2011
- S3C, Inc.
- Zhineng ZHU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Media-Compatible Electrically Isolated Pressure Sensor For High Tem...
- Publication number 20100304518
- Publication date Dec 2, 2010
- S3C, Inc.
- James Tjanmeng Suminto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEDIA-COMPATIBLE ELECTRICALLY ISOLATED PRESSURE SENSOR FOR HIGH TEM...
- Publication number 20100224004
- Publication date Sep 9, 2010
- S3C, Inc.
- James Tjanmeng Suminto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Device Packaging And Method
- Publication number 20100044809
- Publication date Feb 25, 2010
- S3C, Inc.
- John Dangtran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor device package having thermally compliant die pad
- Publication number 20080099861
- Publication date May 1, 2008
- S3C, Inc., a California Corporation
- John Dangtran
- G01 - MEASURING TESTING
Information Patent Application
MEMS device package with thermally compliant insert
- Publication number 20070228499
- Publication date Oct 4, 2007
- S3C, Inc.
- John Dangtran
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Trademarklast 30 trademarks

Information Trademark
77156936 - [NY]2
- Serial number 77156936
- Filing date Apr 14, 2007
- s3c inc.
- 40 - Treatment of materials

Organization

Patents Grantslast 30 patents

Smart diagnosis and protection circuits for ASIC wiring fault condi...

Submersible electronic sensor

Mechanical packaging technique of attaching MEMS and flex circuit

Sensor device packaging

Media-compatible electrically isolated pressure sensor for high tem...

Media-compatible electrically isolated pressure sensor for high tem...

Temperature compensated RC oscillator for signal conditioning ASIC...

Media-compatible electrically isolated pressure sensor for high tem...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR MINIMIZING DEFLECTION OF A MEMBRANCE OF AN AB...

MEDIA-COMPATIBLE ELECTRICALLY ISOLATED PRESSURE SENSOR FOR HIGH TEM...

PROCESS FOR MINIMIZING CHIPPING WHEN SEPARATING MEMS DIES ON A WAFER

MECHANICAL PACKAGING TECHNIQUE OF ATTACHING MEMS AND FLEX CIRCUIT

SUBMERSIBLE ELECTRONIC SENSOR

TEMPERATURE COMPENSATED RC OSCILLATOR FOR SIGNAL CONDITIONING ASIC...

Media-Compatible Electrically Isolated Pressure Sensor For High Tem...

MEDIA-COMPATIBLE ELECTRICALLY ISOLATED PRESSURE SENSOR FOR HIGH TEM...

Sensor Device Packaging And Method

Sensor device package having thermally compliant die pad

MEMS device package with thermally compliant insert

Trademarklast 30 trademarks

77156936 - [NY]2