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SDP Global (China) Co., Ltd.

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  • Guangzhou City, CN
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  • Information Patent Application

    CHIP-ON-FILM PACKAGE STRUCTURE
    • Publication number 20250022767
    • Publication date Jan 16, 2025
    • SDP Global (China) Co., Ltd.
    • TIAN-XUN LIANG
    • H01 - BASIC ELECTRIC ELEMENTS

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