Semiconductor Manufacturing International (Shanghai) Corporation

Organization

Shanghai, CN

Ticker Symbols

NYSE:SMI

SEMICONDUCTORS & RELATED DEVICES
Business Address
18 ZHANG JIANG ROAD PUDONG AREA SHANGHAI F4 00000 86 21 38610000
Mailing Address
NO. 18, ZHANGJIANG ROAD PUDONG NEW AREA SHANGHAI F4 201203
State Location
F4
State of Incorporation

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Wet etching method
- Patent number 12,183,588
- Issue date Dec 31, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tianyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,176,420
- Issue date Dec 24, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,166,125
- Issue date Dec 10, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,159,920
- Issue date Dec 3, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wufeng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 12,125,896
- Issue date Oct 22, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,096,696
- Issue date Sep 17, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- G11 - INFORMATION STORAGE
Information Patent Grant
Improving resolution of masks for semiconductor manufacture
- Patent number 12,087,582
- Issue date Sep 10, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,089,501
- Issue date Sep 10, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,080,596
- Issue date Sep 3, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,075,705
- Issue date Aug 27, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wen Bin Xia
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,074,163
- Issue date Aug 27, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wu Feng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,068,163
- Issue date Aug 20, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,068,397
- Issue date Aug 20, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,051,737
- Issue date Jul 30, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,048,133
- Issue date Jul 23, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure formation method
- Patent number 12,022,740
- Issue date Jun 25, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,015,067
- Issue date Jun 18, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method for thereof
- Patent number 11,996,460
- Issue date May 28, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ji Shiliang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection method and apparatus, electronic device, and storage medium
- Patent number 11,995,814
- Issue date May 28, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang Meng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,996,469
- Issue date May 28, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,990,415
- Issue date May 21, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tiantian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting overlay precision and method for compensating...
- Patent number 11,988,968
- Issue date May 21, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Song Bai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method
- Patent number 11,961,737
- Issue date Apr 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Zhenyu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,550
- Issue date Apr 9, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,955,483
- Issue date Apr 9, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 11,950,400
- Issue date Apr 2, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure and fabrication method thereof
- Patent number 11,943,918
- Issue date Mar 26, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Liang Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,921,318
- Issue date Mar 5, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xiaojun Chen
- G02 - OPTICS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,908,906
- Issue date Feb 20, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hailong Yu
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR AND METHOD OF FORMING THE SAME
- Publication number 20240404751
- Publication date Dec 5, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xingkai HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387622
- Publication date Nov 21, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Kuchanuri SUBHASH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC SENSOR AND FABRICATION METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240355851
- Publication date Oct 24, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hongmin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240355911
- Publication date Oct 24, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240332400
- Publication date Oct 3, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240321997
- Publication date Sep 26, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hailong YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240313078
- Publication date Sep 19, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240313042
- Publication date Sep 19, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240274466
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY CELL AND MAGNETIC RANDOM ACCESS MEMORY
- Publication number 20240276889
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY CELL AND MEMORY
- Publication number 20240274175
- Publication date Aug 15, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240266289
- Publication date Aug 8, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20240258238
- Publication date Aug 1, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Zengsheng XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FORMATION METHOD, AND OPERATION METHOD
- Publication number 20240250087
- Publication date Jul 25, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND FABRICATION METHOD THEREOF
- Publication number 20240234599
- Publication date Jul 11, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Dayong YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240224490
- Publication date Jul 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yijun ZHANG
Information Patent Application
PIXEL UNIT, PHOTODETECTOR AND FABRICATION METHOD THEREOF
- Publication number 20240222406
- Publication date Jul 4, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Xing CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240222486
- Publication date Jul 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC SENSOR AND FABRICATION METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240222415
- Publication date Jul 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Siriguleng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20240203877
- Publication date Jun 20, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bo SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240186233
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240186253
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL UNIT, OPTICAL DETECTOR, FORMATION METHOD, THE READOUT METHOD
- Publication number 20240186360
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Qiongtao WU
- G01 - MEASURING TESTING
Information Patent Application
IMAGE SENSOR AND FORMATION METHOD THEREOF
- Publication number 20240186362
- Publication date Jun 6, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Zhanjie LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240178186
- Publication date May 30, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20240178203
- Publication date May 30, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240170401
- Publication date May 23, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yichao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATION IMAGE SENSOR AND METHOD OF FORMING THE SAME
- Publication number 20240162262
- Publication date May 16, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Huike WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240145590
- Publication date May 2, 2024
- Semiconductor Manufacturing International (Beijing) Corporation
- Ye WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240128265
- Publication date Apr 18, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian CHEN
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
85281163 - SMIC
- Serial number 85281163
- Registration number 4232214
- Filing date Mar 30, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77024713 - DDF
- Serial number 77024713
- Filing date Oct 19, 2006
- Semiconductor Manufacturing International (Shanghai) Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78377294 - SMIC
- Serial number 78377294
- Filing date Mar 2, 2004
- Semiconductor Manufacturing International (Shanghai) Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78377300 - SMIC
- Serial number 78377300
- Filing date Mar 2, 2004
- Semiconductor Manufacturing International (Shanghai) Corporation
- 40 - Treatment of materials
Information Trademark
78377315
- Serial number 78377315
- Registration number 3136563
- Filing date Mar 2, 2004
- Semiconductor Manufacturing International (Shanghai) Corporation
- 40 - Treatment of materials
Information Trademark
78377310
- Serial number 78377310
- Filing date Mar 2, 2004
- Semiconductor Manufacturing International (Shanghai) Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76299387 - SMIC
- Serial number 76299387
- Filing date Aug 15, 2001
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76299389 - SMIC
- Serial number 76299389
- Filing date Aug 15, 2001
- SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP
- 40 - Treatment of materials

Semiconductor Manufacturing International (Shanghai) Corporation

Organization

Ticker Symbols

Business Address

Mailing Address

State Location

State of Incorporation

Patents Grantslast 30 patents

Wet etching method

Semiconductor structure and method for forming the same

Semiconductor structure and method for forming the same

Semiconductor structure and fabrication method thereof

Semiconductor structure with a contact to source/drain layers and f...

Semiconductor device and forming method thereof

Semiconductor structure and fabrication method thereof

Improving resolution of masks for semiconductor manufacture

Semiconductor structure and fabrication method thereof

Semiconductor structure and forming method thereof

Semiconductor structure and fabrication method thereof

Semiconductor structure and fabrication method thereof

Method for forming semiconductor structure

Semiconductor structure and fabrication method thereof

Semiconductor device and fabrication method thereof

Semiconductor structure

Semiconductor structure formation method

Semiconductor device and fabrication method thereof

Semiconductor structure and forming method for thereof

Detection method and apparatus, electronic device, and storage medium

Semiconductor structure and method for forming the same

Semiconductor device and method for forming the same

Method for detecting overlay precision and method for compensating...

Semiconductor structure and manufacturing method

Semiconductor device

Semiconductor device and fabrication method thereof

Semiconductor device and forming method thereof

Memory structure and fabrication method thereof

Semiconductor structure and method of forming the same

Semiconductor structure and fabrication method thereof

Patents Applicationslast 30 patents

CAPACITOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PHOTOELECTRIC SENSOR AND FABRICATION METHOD THEREOF, AND ELECTRONIC...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

MAGNETIC RANDOM ACCESS MEMORY CELL AND MAGNETIC RANDOM ACCESS MEMORY

MAGNETIC RANDOM ACCESS MEMORY CELL AND MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE, FORMATION METHOD, AND OPERATION METHOD

IMAGE SENSOR AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE

PIXEL UNIT, PHOTODETECTOR AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

PHOTOELECTRIC SENSOR AND FABRICATION METHOD THEREOF, AND ELECTRONIC...

SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

PIXEL UNIT, OPTICAL DETECTOR, FORMATION METHOD, THE READOUT METHOD

IMAGE SENSOR AND FORMATION METHOD THEREOF

PACKAGING STRUCTURE AND PACKAGING METHOD

PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

BACKSIDE ILLUMINATION IMAGE SENSOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE

Trademarklast 30 trademarks

85281163 - SMIC

77024713 - DDF

78377294 - SMIC

78377300 - SMIC

78377315

78377310

76299387 - SMIC

76299389 - SMIC