Semiconductor Technologies & Instruments, Inc.

Organization

Dallas, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
System and method for inspecting bumped wafers
- Patent number 6,765,666
- Issue date Jul 20, 2004
- Semiconductor Technologies & Instruments, Inc.
- Clyde Maxwell Guest
- G01 - MEASURING TESTING
Information Patent Grant
System and method for locating irregular edges in image data
- Patent number 6,459,807
- Issue date Oct 1, 2002
- Semiconductor Technologies & Instruments, Inc.
- Clyde Maxwell Guest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional lead inspection system
- Patent number 6,445,518
- Issue date Sep 3, 2002
- Semiconductor Technologies & Instruments, Inc.
- Pao Meng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Post-seal inspection system and method
- Patent number 6,396,578
- Issue date May 28, 2002
- Semiconductor Technologies & Instruments, Inc.
- Tay Bok Her
- G01 - MEASURING TESTING
Information Patent Grant
Post-seal inspection system and method
- Patent number 6,259,522
- Issue date Jul 10, 2001
- Semiconductor Technologies & Instruments, Inc.
- Tay Bok Her
- G01 - MEASURING TESTING
Information Patent Grant
System and method for selection of a reference die
- Patent number 6,252,981
- Issue date Jun 26, 2001
- Semiconductor Technologies & Instruments, Inc.
- Clyde Maxwell Guest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adaptive lighting system and method for machine vision apparatus
- Patent number 6,207,946
- Issue date Mar 27, 2001
- Semiconductor Technologies & Instruments, Inc.
- Noor Ashedah Binti Jusoh
- G01 - MEASURING TESTING
Information Patent Grant
Single station cutting apparatus for separating semiconductor packages
- Patent number 6,178,861
- Issue date Jan 30, 2001
- Semiconductor Technologies & Instruments, Inc.
- Tan Huek Choy
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Single station cutting apparatus for separating semiconductor packages
- Patent number 6,173,632
- Issue date Jan 16, 2001
- Semiconductor Technologies & Instruments, Inc.
- Tan Huek Choy
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
High speed lead inspection system
- Patent number 6,128,034
- Issue date Oct 3, 2000
- Semiconductor Technologies & Instruments, Inc.
- Charles K. Harris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for inspecting a workpiece
- Patent number 6,118,540
- Issue date Sep 12, 2000
- Semiconductor Technologies & Instruments, Inc.
- Rajiv Roy
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device lead calibration unit
- Patent number 5,838,434
- Issue date Nov 17, 1998
- Semiconductor Technologies & Instruments, Inc.
- David A. Skramsted
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
J-lead conditioning method and apparatus
- Patent number 5,826,630
- Issue date Oct 27, 1998
- Semiconductor Technologies & Instruments, Inc.
- Troy D. Moore
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable lead conditioner
- Patent number 5,777,886
- Issue date Jul 7, 1998
- Semiconductor Technologies & Instruments, Inc.
- Michael D. Glucksman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for inspecting integrated circuit lead burrs
- Patent number 5,745,593
- Issue date Apr 28, 1998
- Semiconductor Technologies & Instruments, Inc.
- Weerakiat Wahawisan
- G06 - COMPUTING CALCULATING COUNTING

Semiconductor Technologies & Instruments, Inc.

Organization

Patents Grantslast 30 patents

System and method for inspecting bumped wafers

System and method for locating irregular edges in image data

Three dimensional lead inspection system

Post-seal inspection system and method

Post-seal inspection system and method

System and method for selection of a reference die

Adaptive lighting system and method for machine vision apparatus

Single station cutting apparatus for separating semiconductor packages

Single station cutting apparatus for separating semiconductor packages

High speed lead inspection system

Method and apparatus for inspecting a workpiece

Semiconductor device lead calibration unit

J-lead conditioning method and apparatus

Programmable lead conditioner

Method and system for inspecting integrated circuit lead burrs