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SFA Semicon Co., Ltd.
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Cheonan-si, KR
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Patents Grants
last 30 patents
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Patent Grant
Method of manufacturing fan-out type wafer level package
Patent number
10,103,117
Issue date
Oct 16, 2018
SFA SEMICON CO., LTD.
Hyun Hak Jung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
9,935,072
Issue date
Apr 3, 2018
SFA SEMICON CO., LTD.
Byeong Ho Jeong
H01 - BASIC ELECTRIC ELEMENTS
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Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20170125369
Publication date
May 4, 2017
SFA Semicon Co., Ltd.
Byeong Ho JEONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING FAN-OUT TYPE WAFER LEVEL PACKAGE
Publication number
20170062368
Publication date
Mar 2, 2017
SFA Semicon Co., Ltd.
Hyun Hak JUNG
H01 - BASIC ELECTRIC ELEMENTS