SHANGHAI SIMGUI TECHNOLOGY CO., LTD.

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method for semiconductor substrate, and bonded semiconducto...
- Patent number 11,393,772
- Issue date Jul 19, 2022
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride high electron mobility transistor having high break...
- Patent number 11,158,702
- Issue date Oct 26, 2021
- Shanghai Simgui Technology Co., Ltd.
- Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface oxidation method for wafer
- Patent number 11,094,534
- Issue date Aug 17, 2021
- Shanghai Simgui Technology Co., Ltd.
- Huijun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning bonding interface before bonding
- Patent number 10,618,082
- Issue date Apr 14, 2020
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Annealing method for improving bonding strength
- Patent number 10,529,590
- Issue date Jan 7, 2020
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing substrate with insulated buried layer
- Patent number 10,388,529
- Issue date Aug 20, 2019
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing substrate with carrier trapping center
- Patent number 10,361,114
- Issue date Jul 23, 2019
- Shanghai Simgui Technology Co., Ltd.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor substrate with insulating buried...
- Patent number 9,299,556
- Issue date Mar 29, 2016
- SHANGHAI SIMGUI TECHNOLOGY CO. LTD.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming substrate with buried insulating layer
- Patent number 8,633,090
- Issue date Jan 21, 2014
- Shanghai Simgui Technology Co., Ltd.
- Xiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SURFACE OXIDATION METHOD FOR WAFER
- Publication number 20200343086
- Publication date Oct 29, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Huijun XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLANARIZING WAFER SURFACE
- Publication number 20200168452
- Publication date May 28, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PLANARIZING WAFER SURFACE
- Publication number 20200168501
- Publication date May 28, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND BONDED SEMICONDUCTO...
- Publication number 20200098703
- Publication date Mar 26, 2020
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE HIGH ELECTRON MOBILITY TRANSISTOR HAVING HIGH BREAK...
- Publication number 20190393300
- Publication date Dec 26, 2019
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Chen LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR SUBSTRATE WITH INSULATING BURIED...
- Publication number 20130273714
- Publication date Oct 17, 2013
- SHANGHAI SIMGUI TECHNOLOGY CO., LTD.
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SUBSTRATE WITH BURIED INSULATING LAYER
- Publication number 20120122299
- Publication date May 17, 2012
- SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY...
- Xiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

SHANGHAI SIMGUI TECHNOLOGY CO., LTD.

Organization

Patents Grantslast 30 patents

Bonding method for semiconductor substrate, and bonded semiconducto...

Gallium nitride high electron mobility transistor having high break...

Surface oxidation method for wafer

Method for cleaning bonding interface before bonding

Annealing method for improving bonding strength

Method for preparing substrate with insulated buried layer

Method for preparing substrate with carrier trapping center

Method for preparing semiconductor substrate with insulating buried...

Method for forming substrate with buried insulating layer

Patents Applicationslast 30 patents

SURFACE OXIDATION METHOD FOR WAFER

METHOD FOR PLANARIZING WAFER SURFACE

METHOD FOR PLANARIZING WAFER SURFACE

BONDING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND BONDED SEMICONDUCTO...

GALLIUM NITRIDE HIGH ELECTRON MOBILITY TRANSISTOR HAVING HIGH BREAK...

METHOD FOR PREPARING SEMICONDUCTOR SUBSTRATE WITH INSULATING BURIED...

METHOD FOR FORMING SUBSTRATE WITH BURIED INSULATING LAYER

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