Shengyi Technology Co., Ltd.

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Guangdong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition and prepreg, laminate and printed c...
- Patent number 12,122,904
- Issue date Oct 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Huayong Fan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg containing same, laminate, and printed c...
- Patent number 12,104,054
- Issue date Oct 1, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Liexiang He
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, prepreg containing same, metal foi...
- Patent number 11,975,507
- Issue date May 7, 2024
- Shengyi Technology Co., Ltd.
- Zhenwen Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg for printed circuit and metal-coated lam...
- Patent number 11,970,591
- Issue date Apr 30, 2024
- Shengyi Technology Co., Ltd.
- Yundong Meng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fluorine-containing resin composition, and resin vanish, fluorine-c...
- Patent number 11,945,924
- Issue date Apr 2, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Songgang Chai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite, high-frequency circuit substrate prepared therefrom and...
- Patent number 11,744,013
- Issue date Aug 29, 2023
- SHENGYI TECHNOLOGY CO., LTD.
- Minshe Su
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition, and prepreg, laminate and printed...
- Patent number 11,732,123
- Issue date Aug 22, 2023
- SHENGYI TECHNOLOGY CO., LTD.
- Zengbiao Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Boron nitride agglomerate, thermosetting resin composition containi...
- Patent number 11,661,378
- Issue date May 30, 2023
- Shengyi Technology Co., Ltd.
- Zengbiao Huang
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Resin composition for a metal substrate, and resin varnish and meta...
- Patent number 11,649,351
- Issue date May 16, 2023
- Shengyi Technology Co., Ltd.
- Naidong She
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and prepreg and circuit material using the same
- Patent number 11,584,851
- Issue date Feb 21, 2023
- SHENGYI TECHNOLOGY CO., LTD.
- Jianying Shi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition and prepreg and metal foil-covered...
- Patent number 11,390,735
- Issue date Jul 19, 2022
- Shengyi Technology Co., Ltd.
- Chiji Guan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition, prepreg made therefrom, laminate c...
- Patent number 11,377,551
- Issue date Jul 5, 2022
- SHENGYI TECHNOLOGY CO., LTD.
- Minshe Su
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition, prepreg made therefrom, laminate c...
- Patent number 11,319,397
- Issue date May 3, 2022
- Shengyi Technology Co., Ltd.
- Minshe Su
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition, prepreg, laminate, and printed cir...
- Patent number 11,261,305
- Issue date Mar 1, 2022
- Shengyi Technology Co., Ltd.
- Guangbin Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and process for preparing the same
- Patent number 11,191,158
- Issue date Nov 30, 2021
- SHENGYI TECHNOLOGY CO., LTD.
- Shanyin Yan
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method for preparing benzoxazine-containing resin composition, and...
- Patent number 11,180,617
- Issue date Nov 23, 2021
- Shengyi Technology Co., Ltd.
- Jiang Li
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Vinyl thermosetting resin composition, prepreg, laminate, and print...
- Patent number 11,053,352
- Issue date Jul 6, 2021
- Shengyi Technology Co., Ltd.
- Guangbin Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and pre-preg and laminate using the composition
- Patent number 10,858,514
- Issue date Dec 8, 2020
- Shengyi Technology Co., Ltd.
- Xianping Zeng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyphenyl ether resin composition and use thereof in high-frequenc...
- Patent number 10,745,599
- Issue date Aug 18, 2020
- Shengyi Technology Co., Ltd.
- Guangbing Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Halogen-free epoxy resin composition and a prepreg and a laminate u...
- Patent number 10,723,875
- Issue date Jul 28, 2020
- Shengyi Technology Co., Ltd.
- Xianping Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free flame retardant type resin composition
- Patent number 10,696,844
- Issue date Jun 30, 2020
- SHENGYI TECHNOLOGY CO., LTD.
- Long Xi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyphenyl ether resin composition and use thereof in high-frequenc...
- Patent number 10,645,806
- Issue date May 5, 2020
- Shengyi Technology Co., Ltd.
- Guangbing Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and pre-preg and laminate using the composition
- Patent number 10,584,222
- Issue date Mar 10, 2020
- Shengyi Technology Co., Ltd.
- Xianping Zeng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Epoxy resin composition, prepreg and laminate prepared therefrom
- Patent number 10,544,255
- Issue date Jan 28, 2020
- SHENGYI TECHNOLOGY CO., LTD.
- Haosheng Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Halogen-free epoxy resin composition, prepreg, laminate and printed...
- Patent number 10,513,605
- Issue date Dec 24, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for preparing resin composition comprising benzoxazine, pre...
- Patent number 10,513,608
- Issue date Dec 24, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Long Xi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Halogen-free thermosetting resin composition, prepreg, laminate and...
- Patent number 10,494,502
- Issue date Dec 3, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Jiang You
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyphenyl ether resin composition and prepreg, laminated board and...
- Patent number 10,465,069
- Issue date Nov 5, 2019
- Shengyi Technology Co., Ltd.
- Guangbing Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Halogen-free and phosphorus-free silicone resin composition, prepre...
- Patent number 10,414,136
- Issue date Sep 17, 2019
- Shengyi Technology Co., Ltd.
- Xiaosheng Su
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

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Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND USE THEREOF
- Publication number 20240294731
- Publication date Sep 5, 2024
- Shengyi Technology Co., Ltd.
- Qing WANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20240287282
- Publication date Aug 29, 2024
- Shengyi Technology Co., Ltd.
- Naidong SHE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, INSULATING RESIN FILM AND USE THEREOF
- Publication number 20240228765
- Publication date Jul 11, 2024
- Shengyi Technology Co., Ltd.
- Cheng LUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF
- Publication number 20240218217
- Publication date Jul 4, 2024
- Shengyi Technology Co., Ltd.
- Jinchao DONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20240110027
- Publication date Apr 4, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Cheng LUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN ADHESIVE FILM, AND APPLICATION THEREOF
- Publication number 20240084137
- Publication date Mar 14, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Dongliang LIU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...
- Publication number 20240064910
- Publication date Feb 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Junqi TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER CLAD...
- Publication number 20240010810
- Publication date Jan 11, 2024
- Shengyi Technology Co., Ltd.
- Weifeng YIN
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION AND RESIN FILM, PREPREG, LAMINATED BOARD, COPPER-...
- Publication number 20230257583
- Publication date Aug 17, 2023
- Shengyi Technology Co., Ltd.
- Guangbing CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DIELECTRIC LOSS NON-WOVEN FABRIC, PREPARATION METHOD THEREOF AN...
- Publication number 20230202126
- Publication date Jun 29, 2023
- SHENGYI TECHNOLOGY CO., LTD.
- Wei LIANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fluorine-Containing Resin Composition, and Resin Vanish, Fluorine-C...
- Publication number 20230192972
- Publication date Jun 22, 2023
- Shengyi Technology Co., Ltd.
- Songgang CHAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED...
- Publication number 20230063436
- Publication date Mar 2, 2023
- Shengyi Technology Co., Ltd.
- Zengbiao HUANG
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED C...
- Publication number 20230045848
- Publication date Feb 16, 2023
- Shengyi Technology Co., Ltd.
- Huayong FAN
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD...
- Publication number 20230045615
- Publication date Feb 9, 2023
- Shengyi Technology Co., Ltd.
- Yong CHEN
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND...
- Publication number 20220227942
- Publication date Jul 21, 2022
- Shengyi Technology Co., Ltd.
- Hongjie LI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COPPER CLAD LAMINATE AND PRINTED-CIRCUIT BOARD
- Publication number 20220210914
- Publication date Jun 30, 2022
- Shengyi Technology Co., Ltd.
- Guangbing CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATE, AND PRINTED C...
- Publication number 20220153989
- Publication date May 19, 2022
- SHENGYI TECHNOLOGY CO., LTD.
- Liexiang HE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG CONTAINING SAME, AND LAMINATE BOARD AND...
- Publication number 20220135788
- Publication date May 5, 2022
- SHENGYI TECHNOLOGY CO., LTD.
- Liexiang HE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, METAL FOI...
- Publication number 20220056225
- Publication date Feb 24, 2022
- Shengyi Technology Co., Ltd.
- Zhenwen CHEN
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE AND METAL FOIL-CLAD LAMINATE
- Publication number 20220056260
- Publication date Feb 24, 2022
- Shengyi Technology Co., Ltd.
- Junqi TANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT AND METAL-COATED LAM...
- Publication number 20210403659
- Publication date Dec 30, 2021
- Shengyi Technology Co., Ltd.
- Yundong MENG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME
- Publication number 20210307164
- Publication date Sep 30, 2021
- Shengyi Technology Co., Ltd.
- Weifeng YIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, AND PREPREG AND CIRCUIT MATERIAL USING THE SAME
- Publication number 20210301130
- Publication date Sep 30, 2021
- Shengyi Technology Co., Ltd.
- Jianying SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BORON NITRIDE AGGLOMERATE, THERMOSETTING RESIN COMPOSITION CONTAINI...
- Publication number 20210221743
- Publication date Jul 22, 2021
- Shengyi Technology Co., Ltd.
- Zengbiao HUANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LA...
- Publication number 20210070980
- Publication date Mar 11, 2021
- Shengyi Technology Co., Ltd.
- Xianping ZENG
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND META...
- Publication number 20200332109
- Publication date Oct 22, 2020
- Shengyi Technology Co., Ltd.
- Naidong SHE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SILICONE-MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THE...
- Publication number 20200283575
- Publication date Sep 10, 2020
- Shengyi Technology Co., Ltd.
- Chane YUAN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINT...
- Publication number 20200247947
- Publication date Aug 6, 2020
- Shengyi Technology Co., Ltd.
- Guangbin CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIR...
- Publication number 20200247970
- Publication date Aug 6, 2020
- Shengyi Technology Co., Ltd.
- Guangbin CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE C...
- Publication number 20200224026
- Publication date Jul 16, 2020
- SHENGYI TECHNOLOGY CO., LTD.
- Minshe SU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Shengyi Technology Co., Ltd.

Organization

Patents Grantslast 30 patents

Thermosetting resin composition and prepreg, laminate and printed c...

Resin composition, prepreg containing same, laminate, and printed c...

Thermosetting resin composition, prepreg containing same, metal foi...

Resin composition, prepreg for printed circuit and metal-coated lam...

Fluorine-containing resin composition, and resin vanish, fluorine-c...

Circuit material and circuit board containing the same

Composite, high-frequency circuit substrate prepared therefrom and...

Thermosetting resin composition, and prepreg, laminate and printed...

Boron nitride agglomerate, thermosetting resin composition containi...

Resin composition for a metal substrate, and resin varnish and meta...

Resin composition, and prepreg and circuit material using the same

Thermosetting resin composition and prepreg and metal foil-covered...

Thermosetting resin composition, prepreg made therefrom, laminate c...

Thermosetting resin composition, prepreg made therefrom, laminate c...

Thermosetting resin composition, prepreg, laminate, and printed cir...

Circuit board and process for preparing the same

Method for preparing benzoxazine-containing resin composition, and...

Vinyl thermosetting resin composition, prepreg, laminate, and print...

Resin composition and pre-preg and laminate using the composition

Polyphenyl ether resin composition and use thereof in high-frequenc...

Halogen-free epoxy resin composition and a prepreg and a laminate u...

Halogen-free flame retardant type resin composition

Polyphenyl ether resin composition and use thereof in high-frequenc...

Resin composition and pre-preg and laminate using the composition

Epoxy resin composition, prepreg and laminate prepared therefrom

Halogen-free epoxy resin composition, prepreg, laminate and printed...

Process for preparing resin composition comprising benzoxazine, pre...

Halogen-free thermosetting resin composition, prepreg, laminate and...

Polyphenyl ether resin composition and prepreg, laminated board and...

Halogen-free and phosphorus-free silicone resin composition, prepre...

Patents Applicationslast 30 patents

RESIN COMPOSITION AND USE THEREOF

RESIN COMPOSITION AND APPLICATION THEREOF

RESIN COMPOSITION, INSULATING RESIN FILM AND USE THEREOF

THERMOSETTING RESIN COMPOSITION AND INSULATING ADHESIVE FILM THEREOF

THERMOSETTING RESIN COMPOSITION AND APPLICATION THEREOF

RESIN COMPOSITION, RESIN ADHESIVE FILM, AND APPLICATION THEREOF

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...

MAGNETIC DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER CLAD...

RESIN COMPOSITION AND RESIN FILM, PREPREG, LAMINATED BOARD, COPPER-...

LOW DIELECTRIC LOSS NON-WOVEN FABRIC, PREPARATION METHOD THEREOF AN...

Fluorine-Containing Resin Composition, and Resin Vanish, Fluorine-C...

THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED...

THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE AND PRINTED C...

THERMOSETTING EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD...

RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND...

COPPER CLAD LAMINATE AND PRINTED-CIRCUIT BOARD

RESIN COMPOSITION, PREPREG CONTAINING SAME, LAMINATE, AND PRINTED C...

RESIN COMPOSITION, PREPREG CONTAINING SAME, AND LAMINATE BOARD AND...

THERMOSETTING RESIN COMPOSITION, PREPREG CONTAINING SAME, METAL FOI...

RESIN COMPOSITION, PREPREG, LAMINATE AND METAL FOIL-CLAD LAMINATE

RESIN COMPOSITION, PREPREG FOR PRINTED CIRCUIT AND METAL-COATED LAM...

CIRCUIT MATERIAL AND CIRCUIT BOARD CONTAINING THE SAME

RESIN COMPOSITION, AND PREPREG AND CIRCUIT MATERIAL USING THE SAME

BORON NITRIDE AGGLOMERATE, THERMOSETTING RESIN COMPOSITION CONTAINI...

THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LA...

RESIN COMPOSITION FOR A METAL SUBSTRATE, AND RESIN VARNISH AND META...

SILICONE-MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THE...

VINYL THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINT...

THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, AND PRINTED CIR...

THERMOSETTING RESIN COMPOSITION, PREPREG MADE THEREFROM, LAMINATE C...