Shin-Etsu Engineering Co., Ltd.

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Workpiece-separating device and workpiece-separating method
- Patent number 11,654,513
- Issue date May 23, 2023
- Shin-Etsu Engineering Co., Ltd.
- Yoshikazu Ohtani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece-separating device and workpiece-separating method
- Patent number 11,633,810
- Issue date Apr 25, 2023
- Shin-Etsu Engineering Co., Ltd.
- Yoshikazu Ohtani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,322,384
- Issue date May 3, 2022
- Shin-Etsu Engineering Co., Ltd.
- Shunya Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece-separating device and workpiece-separating method
- Patent number 11,251,058
- Issue date Feb 15, 2022
- Shin-Etsu Engineering Co., Ltd.
- Kyouhei Tomioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece-separating device and workpiece-separating method
- Patent number 10,840,141
- Issue date Nov 17, 2020
- Shin-Etsu Engineering Co., Ltd.
- Yoshikazu Ohtani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing polishing head and polishing apparatus
- Patent number 10,293,460
- Issue date May 21, 2019
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Steam generator
- Patent number 6,437,304
- Issue date Aug 20, 2002
- Sanyo Electric Co., LTD
- Kazufumi Ushijima
- F22 - STEAM GENERATION
Information Patent Grant
Automatic dimension analyzer
- Patent number 4,731,745
- Issue date Mar 15, 1988
- Shin-Etsu Engineering Co., Ltd.
- Kiyoo Katagiri
- G01 - MEASURING TESTING
Information Patent Grant
Method for controlling thickness of wafer-like work pieces under la...
- Patent number 4,433,510
- Issue date Feb 28, 1984
- Shin-Etsu Engineering Co., Ltd.
- Kiyoo Katagiri
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
LASER LIFT-OFF METHOD, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE,...
- Publication number 20250018510
- Publication date Jan 16, 2025
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu Ohtani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING APPARATUS, PROCESSING METHOD, AND MANUFACTURING METHOD O...
- Publication number 20240399497
- Publication date Dec 5, 2024
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu Ohtani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microfluidic Device
- Publication number 20240375115
- Publication date Nov 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masao ANDO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
FILM FORMING APPARATUS AND METHOD OF FORMING CRYSTALLINE SEMICONDUC...
- Publication number 20240234140
- Publication date Jul 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi HASHIGAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSFER APPARATUS AND TRANSFER METHOD
- Publication number 20240051068
- Publication date Feb 15, 2024
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
- Publication number 20230321752
- Publication date Oct 12, 2023
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
- Publication number 20220410321
- Publication date Dec 29, 2022
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
- Publication number 20220068676
- Publication date Mar 3, 2022
- SHIN-ETSU ENGINEERING CO., LTD
- Kyouhei TOMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
- Publication number 20210245297
- Publication date Aug 12, 2021
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210098279
- Publication date Apr 1, 2021
- SHIN-ETSU ENGINEERING CO., LTD
- Shunya KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
- Publication number 20200312716
- Publication date Oct 1, 2020
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN-SEALING DEVICE AND RESIN-SEALING METHOD
- Publication number 20190109021
- Publication date Apr 11, 2019
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF PRODUCING POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20160101503
- Publication date Apr 14, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa HASHIMOTO
- B24 - GRINDING POLISHING

Trademarklast 30 trademarks

Information Trademark
97376161 - CONTACT-LLO
- Serial number 97376161
- Registration number 7283173
- Filing date Apr 22, 2022
- Shin-Etsu Engineering Co., Ltd.
- 7 - Machines and machine tools
Information Trademark
97376157 - GAP-LLO
- Serial number 97376157
- Filing date Apr 22, 2022
- Shin-Etsu Engineering Co., Ltd.
- 7 - Machines and machine tools

Shin-Etsu Engineering Co., Ltd.

Organization

Patents Grantslast 30 patents

Workpiece-separating device and workpiece-separating method

Workpiece-separating device and workpiece-separating method

Substrate processing apparatus and substrate processing method

Workpiece-separating device and workpiece-separating method

Workpiece-separating device and workpiece-separating method

Method of producing polishing head and polishing apparatus

Steam generator

Automatic dimension analyzer

Method for controlling thickness of wafer-like work pieces under la...

Patents Applicationslast 30 patents

LASER LIFT-OFF METHOD, METHOD FOR MANUFACTURING RECEPTOR SUBSTRATE,...

PROCESSING APPARATUS, PROCESSING METHOD, AND MANUFACTURING METHOD O...

Microfluidic Device

FILM FORMING APPARATUS AND METHOD OF FORMING CRYSTALLINE SEMICONDUC...

TRANSFER APPARATUS AND TRANSFER METHOD

WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD

WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD

WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD

WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD

RESIN-SEALING DEVICE AND RESIN-SEALING METHOD

METHOD OF PRODUCING POLISHING HEAD AND POLISHING APPARATUS

Trademarklast 30 trademarks

97376161 - CONTACT-LLO

97376157 - GAP-LLO