Shoshotech Co., Ltd.

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Kanagawa-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of making conductive bump on wiring board
- Patent number 6,351,885
- Issue date Mar 5, 2002
- Yamaichi Electronics Co., Ltd.
- Etsuji Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipoint conductive sheet
- Patent number 6,217,343
- Issue date Apr 17, 2001
- Shoshotech Co., Ltd.
- Toshio Okuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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