SIGURD MICROELECTRONICS CORP.

Organization

SHIN-CHU, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package with metal shielding structure and the manufact...
- Patent number 9,831,197
- Issue date Nov 28, 2017
- Sigurd Microelectronics Corp.
- Tsan-Lien Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method of a light-sensing semiconductor device and packag...
- Patent number 7,547,571
- Issue date Jun 16, 2009
- Sigurd Microelectronics Corp.
- Po-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor chip package
- Patent number 7,405,456
- Issue date Jul 29, 2008
- Sigurd Microelectronics Corp.
- Po-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of a light-sensing element and fabrication meth...
- Patent number 7,358,482
- Issue date Apr 15, 2008
- Sigurd Microelectronics Corp.
- Po-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of a light-sensing device with a spacer wall
- Patent number 7,323,675
- Issue date Jan 29, 2008
- Sigurd Microelectronics Corp.
- Po-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure and image sensing module
- Patent number 7,297,918
- Issue date Nov 20, 2007
- Sigurd Microelectronics Corp.
- Po-Hung Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensing chip package structure
- Patent number 7,282,788
- Issue date Oct 16, 2007
- Sigurd Microelectronics Corp.
- Po-Hung Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE STRUCTURE AND METHOD
- Publication number 20160207762
- Publication date Jul 21, 2016
- SIGURD MICROELECTRONICS CORP.
- CHIH-WEI LU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RF PARAMETER CALIBRATION METHOD
- Publication number 20160146920
- Publication date May 26, 2016
- SIGURD MICROELECTRONICS CORP.
- CHIEN-HUNG LIN
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL PACKAGE MODULE
- Publication number 20140042305
- Publication date Feb 13, 2014
- SIGURD MICROELECTRONICS CORP.
- CHIU-WEI LIU
- G01 - MEASURING TESTING
Information Patent Application
COMPACT SENSOR PACKAGE STRUCTURE
- Publication number 20120025211
- Publication date Feb 2, 2012
- SIGURD MICROELECTRONICS CORP.
- TSAN-LIEN YEH
- H01 - BASIC ELECTRIC ELEMENTS

SIGURD MICROELECTRONICS CORP.

Organization

Patents Grantslast 30 patents

Wafer-level package with metal shielding structure and the manufact...

Packaging method of a light-sensing semiconductor device and packag...

Optical sensor chip package

Packaging structure of a light-sensing element and fabrication meth...

Packaging structure of a light-sensing device with a spacer wall

Image sensor package structure and image sensing module

Image sensing chip package structure

Patents Applicationslast 30 patents

SENSOR PACKAGE STRUCTURE AND METHOD

RF PARAMETER CALIBRATION METHOD

OPTICAL PACKAGE MODULE

COMPACT SENSOR PACKAGE STRUCTURE

Trademarklast 30 trademarks