Silicon Matrix Pte. Ltd.

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Singapore, SG

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
MEMS packaging method for enhanced EMI immunity using flexible subs...
- Patent number 7,692,288
- Issue date Apr 6, 2010
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone with a stacked PCB package and method of producing...
- Patent number 7,436,054
- Issue date Oct 14, 2008
- Silicon Matrix, Pte. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Backplateless silicon microphone
- Patent number 7,346,178
- Issue date Mar 18, 2008
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon microphone with softly constrained diaphragm
- Patent number 7,329,933
- Issue date Feb 12, 2008
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS package using flexible substrates, and method thereof
- Patent number 7,202,552
- Issue date Apr 10, 2007
- Silicon Matrix Pte. Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS G-switch device
- Publication number 20100108478
- Publication date May 6, 2010
- Silicon Matrix Pte Ltd
- Wang Zhe
- G01 - MEASURING TESTING
Information Patent Application
Folded lead-frame packages for MEMS devices
- Publication number 20100090295
- Publication date Apr 15, 2010
- Silicon Matrix Pte Ltd
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Double-side mountable MEMS package
- Publication number 20090218668
- Publication date Sep 3, 2009
- Silicon Matrix Pte Ltd
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon microphone without dedicated backplate
- Publication number 20090208037
- Publication date Aug 20, 2009
- Silicon Matrix Pte Ltd
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon microphone with enhanced impact proof structure using bondi...
- Publication number 20090092273
- Publication date Apr 9, 2009
- Silicon Matrix Pte Ltd
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Backplateless silicon microphone
- Publication number 20080123878
- Publication date May 29, 2008
- Silicon Matrix, Pte. Ltd.
- Wang Zhe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Silicon microphone with impact proof structure
- Publication number 20080031476
- Publication date Feb 7, 2008
- Silicon Matrix Pte Ltd
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS microphone with a stacked PCB package and method of producing...
- Publication number 20070205492
- Publication date Sep 6, 2007
- Silicon Matrix, Pte. Ltd.
- Zhe Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS packaging method for enhanced EMI immunity using flexible subs...
- Publication number 20070013052
- Publication date Jan 18, 2007
- Silicon Matrix, Pte., Ltd.
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS package using flexible substrates, and method thereof
- Publication number 20070013036
- Publication date Jan 18, 2007
- Silicon Matrix Pte Ltd
- Wang Zhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Silicon Matrix Pte. Ltd.

Organization

Patents Grantslast 30 patents

MEMS packaging method for enhanced EMI immunity using flexible subs...

MEMS microphone with a stacked PCB package and method of producing...

Backplateless silicon microphone

Silicon microphone with softly constrained diaphragm

MEMS package using flexible substrates, and method thereof

Patents Applicationslast 30 patents

MEMS G-switch device

Folded lead-frame packages for MEMS devices

Double-side mountable MEMS package

Silicon microphone without dedicated backplate

Silicon microphone with enhanced impact proof structure using bondi...

Backplateless silicon microphone

Silicon microphone with impact proof structure

MEMS microphone with a stacked PCB package and method of producing...

MEMS packaging method for enhanced EMI immunity using flexible subs...

MEMS package using flexible substrates, and method thereof

Trademarklast 30 trademarks