Silicon Wafer Technologies, Inc.

Organization

Newark, NJ, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Process for forming a fragile layer inside of a single crystalline...
- Patent number 6,995,075
- Issue date Feb 7, 2006
- Silicon Wafer Technologies
- Alexander Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making starting material for chip fabrication comprising...
- Patent number 6,861,320
- Issue date Mar 1, 2005
- Silicon Wafer Technologies, Inc.
- Alexander Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a thin layer of crystalline material
- Patent number 6,806,171
- Issue date Oct 19, 2004
- Silicon Wafer Technologies, Inc.
- Alexander Ulyashin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a multi-layered substrate with a thin sing...
- Patent number 6,696,352
- Issue date Feb 24, 2004
- Silicon Wafer Technologies, Inc.
- William Carr
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Separation process for silicon-on-insulator wafer fabrication
- Patent number 6,387,829
- Issue date May 14, 2002
- Silicon Wafer Technologies, Inc.
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a silicon-on-insulator substrate and semi...
- Patent number 6,368,938
- Issue date Apr 9, 2002
- Silicon Wafer Technologies, Inc.
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming IC's comprising a highly-resistive or se...
- Patent number 6,355,493
- Issue date Mar 12, 2002
- Silicon Wafer Technologies Inc.
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for lift-off of a layer from a substrate
- Patent number 6,352,909
- Issue date Mar 5, 2002
- Silicon Wafer Technologies, Inc.
- Alexander Yuri Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for lift off and transfer of semiconductor devices onto an...
- Patent number 6,346,459
- Issue date Feb 12, 2002
- Silicon Wafer Technologies, Inc.
- Alexander Y Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for micro-mechanical structures
- Patent number 6,344,417
- Issue date Feb 5, 2002
- Silicon Wafer Technologies
- Alexander Usenko
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
78068993 - SI-SANDWICH
- Serial number 78068993
- Registration number 2972598
- Filing date Jun 13, 2001
- Silicon Wafer Technologies, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Silicon Wafer Technologies, Inc.

Organization

Patents Grantslast 30 patents

Process for forming a fragile layer inside of a single crystalline...

Method of making starting material for chip fabrication comprising...

Method of producing a thin layer of crystalline material

Method of manufacture of a multi-layered substrate with a thin sing...

Separation process for silicon-on-insulator wafer fabrication

Process for manufacturing a silicon-on-insulator substrate and semi...

Method for forming IC&#x00027;s comprising a highly-resistive or se...

Process for lift-off of a layer from a substrate

Process for lift off and transfer of semiconductor devices onto an...

Method for micro-mechanical structures

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

78068993 - SI-SANDWICH

Method for forming IC's comprising a highly-resistive or se...