Siliconix Taiwan LTD

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation method and leadframe for leadless semiconductor packages
- Patent number 6,856,006
- Issue date Feb 15, 2005
- Siliconix Taiwan LTD
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
Encapsulation method and leadframe for leadless semiconductor packages
- Publication number 20040169316
- Publication date Sep 2, 2004
- Siliconix Taiwan Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation method and leadframe for leadless semiconductor packages
- Publication number 20030183910
- Publication date Oct 2, 2003
- Siliconix Taiwan Ltd.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS