Siliconware Precision Industries, Ltd., Taiwan

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Patents Applicationslast 30 patents

Information Patent Application
THERMALLY ENHANCED SEMICODUCTOR PACKAGE WITH EMI SHIELDING
- Publication number 20040156172
- Publication date Aug 12, 2004
- Siliconware Precision Industries, Ltd., Taiwan
- Ying-Ren Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with chip supporting structure
- Publication number 20040099931
- Publication date May 27, 2004
- Siliconware Precision Industries, Ltd., Taiwan
- Jung-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window-type ball grid array semiconductor package with lead frame a...
- Publication number 20040080031
- Publication date Apr 29, 2004
- Siliconware Precision Industries, Ltd., Taiwan
- Chien Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity-down ball grid array semiconductor package with heat spreader
- Publication number 20040070948
- Publication date Apr 15, 2004
- Siliconware Precision Industries, Ltd. Taiwan
- Nai-Hao Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage preventing substrate
- Publication number 20040065473
- Publication date Apr 8, 2004
- Siliconware Precision Industries, Ltd., Taiwan
- Chin-Huang Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR