SpeedFam-IPEC Co., Ltd.

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Ayase, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer etching method
- Patent number 6,451,217
- Issue date Sep 17, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-side polishing method for substrate edge, and apparatus ther...
- Patent number 6,402,596
- Issue date Jun 11, 2002
- SpeedFam-IPEC Co., Ltd.
- Shunji Hakomori
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer flattening system
- Patent number 6,360,687
- Issue date Mar 26, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- B24 - GRINDING POLISHING
Information Patent Grant
Local etching apparatus
- Patent number 6,302,995
- Issue date Oct 16, 2001
- SpeedFam-IPEC Co., Ltd.
- Chikai Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening process
- Patent number 6,303,511
- Issue date Oct 16, 2001
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing system and method of control of same
- Patent number 6,074,275
- Issue date Jun 13, 2000
- Speedfam-IPEC, Corporation
- Hiroshi Yashiki
- B24 - GRINDING POLISHING

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