SUMITOMO METAL CERAMICS INC.

Organization

Ohminecho, Mine-shi, Yamaguchi, JP

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Process for forming fine thick-film conductor patterns
- Patent number 6,074,893
- Issue date Jun 13, 2000
- Sumitomo Metal Industries, Ltd.
- Yoshikazu Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick film circuit board
- Patent number 5,709,927
- Issue date Jan 20, 1998
- Nippondenso Co., Ltd.
- Yoshiyuki Miyase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zirconia-added alumina substrate with direct bonding of copper
- Patent number 5,675,181
- Issue date Oct 7, 1997
- Fuji Electric Co., Ltd.
- Masaharu Nishiura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low-temperature fired ceramic circuit substrate and thick-film past...
- Patent number 5,665,459
- Issue date Sep 9, 1997
- Sumitomo Metal Ceramics Inc.
- Junzo Fukuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing glass ceramic green sheets
- Patent number 5,660,781
- Issue date Aug 26, 1997
- Sumitomo Metal Industries, Ltd.
- Yoichi Moriya
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multilayer ceramic circuit substrate, process for producing the sam...
- Patent number 5,627,344
- Issue date May 6, 1997
- Sumitomo Metal Ceramics Inc.
- Nozomi Tanifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board and process for producing same
- Patent number 5,597,644
- Issue date Jan 28, 1997
- Sumitomo Metal Ceramics, Inc.
- Hideaki Araki
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor ceramic package with terminal vias
- Patent number 5,543,661
- Issue date Aug 6, 1996
- Sumitomo Metal Ceramics Inc.
- Reiko Sumida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a circuit substrate
- Patent number 5,470,412
- Issue date Nov 28, 1995
- Sumitomo Metal Ceramics Inc.
- Junzo Fukuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using an aluminum nitride substrate
- Patent number 5,463,248
- Issue date Oct 31, 1995
- Kabushiki Kaisha Toshiba
- Keiichi Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum nitride powder capable of forming colored sintered body an...
- Patent number 5,459,113
- Issue date Oct 17, 1995
- Sumitomo Metal Ceramics Inc.
- Toshio Nozaki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of fabricating ceramic circuit substrate
- Patent number 5,456,778
- Issue date Oct 10, 1995
- Sumitomo Metal Ceramics Inc.
- Junzo Fukuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid for semiconductor package and package having the lid
- Patent number 5,414,300
- Issue date May 9, 1995
- Sumitomo Metal Ceramics Inc.
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package for housing a semiconductor device
- Patent number 5,397,918
- Issue date Mar 14, 1995
- Sumitomo Metal Ceramics, Inc.
- Masao Yokochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate and manufacture thereof
- Patent number 5,156,903
- Issue date Oct 20, 1992
- Sumitomo Metal Ceramics Inc.
- Takamasa Okumura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

Information Trademark
74301748 - HYPER-QFP
- Serial number 74301748
- Filing date Aug 4, 1992
- SUMITOMO METAL CERAMICS INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

SUMITOMO METAL CERAMICS INC.

Organization

Patents Grantslast 30 patents

Process for forming fine thick-film conductor patterns

Thick film circuit board

Zirconia-added alumina substrate with direct bonding of copper

Low-temperature fired ceramic circuit substrate and thick-film past...

Process for preparing glass ceramic green sheets

Multilayer ceramic circuit substrate, process for producing the sam...

Ceramic circuit board and process for producing same

Semiconductor ceramic package with terminal vias

Process for producing a circuit substrate

Semiconductor package using an aluminum nitride substrate

Aluminum nitride powder capable of forming colored sintered body an...

Method of fabricating ceramic circuit substrate

Lid for semiconductor package and package having the lid

Ceramic package for housing a semiconductor device

Multilayer ceramic substrate and manufacture thereof

Patents Applicationslast 30 patents

Trademarklast 30 trademarks

74301748 - HYPER-QFP