Sumitomo Metal (SMI) Electronics Devices, Inc.

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Mine, JP

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Patents Grantslast 30 patents

Information Patent Grant
Package for high frequency usages and its manufacturing method
- Patent number 7,632,716
- Issue date Dec 15, 2009
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Ichirou Muraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-film resistor and ceramic circuit board
- Patent number 6,544,654
- Issue date Apr 8, 2003
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Masashi Fukaya
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Ceramic circuit substrate and method of fabricating the same
- Patent number 6,103,354
- Issue date Aug 15, 2000
- Sumitomo Metal (SMI) Electronic Devices Inc.
- Hideaki Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-film paste and ceramic circuit substrate using the same
- Patent number 6,037,045
- Issue date Mar 14, 2000
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Masashi Fukaya
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
RuO.sub.2 resistor paste, substrate and overcoat system
- Patent number 5,955,938
- Issue date Sep 21, 1999
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Masashi Fukaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 5,912,505
- Issue date Jun 15, 1999
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Takuji Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature fired ceramic circuit substrate and thick-film past...
- Patent number 5,879,788
- Issue date Mar 9, 1999
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Junzo Fukuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid with variable solder layer for sealing semiconductor package, p...
- Patent number 5,821,455
- Issue date Oct 13, 1998
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Tetsuya Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a multilayer ceramic circuit substrate
- Patent number 5,729,893
- Issue date Mar 24, 1998
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Nozomi Tanifuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for manufacturing ceramic semiconductor packages
- Patent number 5,661,090
- Issue date Aug 26, 1997
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Noriaki Otani
- H01 - BASIC ELECTRIC ELEMENTS

Sumitomo Metal (SMI) Electronics Devices, Inc.

Organization

Patents Grantslast 30 patents

Package for high frequency usages and its manufacturing method

Thick-film resistor and ceramic circuit board

Ceramic circuit substrate and method of fabricating the same

Thick-film paste and ceramic circuit substrate using the same

RuO.sub.2 resistor paste, substrate and overcoat system

Semiconductor package and semiconductor device

Low-temperature fired ceramic circuit substrate and thick-film past...

Lid with variable solder layer for sealing semiconductor package, p...

Process for producing a multilayer ceramic circuit substrate

Process and apparatus for manufacturing ceramic semiconductor packages