Sumitomo Metal (SMI) Electronics Devices Inc.

Organization

Mine-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Plastic packaging with high heat dissipation and method for the same
- Patent number 7,023,084
- Issue date Apr 4, 2006
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Shigehisa Tomabechi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation type BGA package and production method therefor
- Patent number 6,861,747
- Issue date Mar 1, 2005
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Takeshi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connected construction of a high-frequency package and a wiring board
- Patent number 6,781,488
- Issue date Aug 24, 2004
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Yoshio Tsukiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 6,620,650
- Issue date Sep 16, 2003
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Yoshikazu Nakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 6,495,394
- Issue date Dec 17, 2002
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Yoshikazu Nakata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency package
- Patent number 6,489,679
- Issue date Dec 3, 2002
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging metal lid
- Patent number 6,306,526
- Issue date Oct 23, 2001
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Tetsuya Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method for manufacturing the same
- Patent number 6,249,053
- Issue date Jun 19, 2001
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Yoshikazu Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for housing a photosemiconductor device
- Patent number 6,242,694
- Issue date Jun 5, 2001
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Ichiro Muraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image capture system
- Patent number 6,222,582
- Issue date Apr 24, 2001
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Tatsuo Shinoda
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming connector structure for a ball-grid array
- Patent number 6,199,273
- Issue date Mar 13, 2001
- Sumitomo Metal Industries, Ltd.
- Toshihiko Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-film resistor paste
- Patent number 6,123,874
- Issue date Sep 26, 2000
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Masashi Fukaya
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Dielectric filter
- Patent number 6,064,283
- Issue date May 16, 2000
- Sumitomo Metal (SMI) Electronics Device, Inc.
- Naoyuki Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved moisture vapor relief function...
- Patent number 6,054,755
- Issue date Apr 25, 2000
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Hiroshi Takamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a ceramic circuit substrate
- Patent number 5,855,711
- Issue date Jan 5, 1999
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Hideaki Araki
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Low-temperature fired ceramic circuit substrate with improved Ag-Au...
- Patent number 5,847,326
- Issue date Dec 8, 1998
- Sumitomo Metal Electronics Devices Inc.
- Katsuya Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayered ceramic substrate
- Patent number 5,814,366
- Issue date Sep 29, 1998
- Sumitomo Metal Electronics Devices Inc.
- Junzo Fukuta
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Silver-based conductive paste and multilayer ceramic circuit substr...
- Patent number 5,766,516
- Issue date Jun 16, 1998
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Junzo Fukuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste containing 2-tetradecanol and ceramic circuit subs...
- Patent number 5,723,073
- Issue date Mar 3, 1998
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Junzo Fukuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick film paste
- Patent number 5,601,638
- Issue date Feb 11, 1997
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Junzo Fukuda
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DE...
- Publication number 20120077023
- Publication date Mar 29, 2012
- SUMITOMO METAL (SMI) ELECTRONICS DEVICE, INC.
- Masanori Nagahiro
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PACKAGE FOR HIGH FREQUENCY USAGES AND ITS MANUFACTURING METHOD
- Publication number 20060193116
- Publication date Aug 31, 2006
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Akiyoshi Osakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic packaging with high heat dissipation and method for the same
- Publication number 20050221537
- Publication date Oct 6, 2005
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Shigehisa Tomabechi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plastic packaging with high heat dissipation and method for the same
- Publication number 20050073044
- Publication date Apr 7, 2005
- Sumitomo Metal Electronics Devices Inc.
- Shigehisa Tomabechi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder coated lid
- Publication number 20040258948
- Publication date Dec 23, 2004
- Senju Metal Industry Co., Ltd.
- Hideyuki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making plastic packages
- Publication number 20040040856
- Publication date Mar 4, 2004
- Sumitomo Metal Electronics Devices Inc.
- Akihiro Hamano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of fabricating multilayer ceramic substrate
- Publication number 20030100146
- Publication date May 29, 2003
- SUMITOMO METAL (SMI) ELECTRONICS DEVICES INC.
- Satoshi Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency ceramic package
- Publication number 20020051353
- Publication date May 2, 2002
- Sumitomo Metal (SMI) Electronics Devices Inc.
- Akiyoshi Osakada
- H01 - BASIC ELECTRIC ELEMENTS

Sumitomo Metal (SMI) Electronics Devices Inc.

Organization

Patents Grantslast 30 patents

Plastic packaging with high heat dissipation and method for the same

Radiation type BGA package and production method therefor

Connected construction of a high-frequency package and a wiring board

Chip package and method for manufacturing the same

Chip package and method for manufacturing the same

High-frequency package

Semiconductor packaging metal lid

Chip package and method for manufacturing the same

Package for housing a photosemiconductor device

Image capture system

Method of forming connector structure for a ball-grid array

Thick-film resistor paste

Dielectric filter

Semiconductor package with improved moisture vapor relief function...

Method of producing a ceramic circuit substrate

Low-temperature fired ceramic circuit substrate with improved Ag-Au...

Method of manufacturing multilayered ceramic substrate

Silver-based conductive paste and multilayer ceramic circuit substr...

Conductive paste containing 2-tetradecanol and ceramic circuit subs...

Thick film paste

Patents Applicationslast 30 patents

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DE...

PACKAGE FOR HIGH FREQUENCY USAGES AND ITS MANUFACTURING METHOD

Plastic packaging with high heat dissipation and method for the same

Plastic packaging with high heat dissipation and method for the same

Solder coated lid

Method for making plastic packages

Method of fabricating multilayer ceramic substrate

High-frequency ceramic package