Tactical Fabs, Inc.

Organization

San Jose, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Roughened and oxidized well chips and method of making same
- Patent number 6,653,121
- Issue date Nov 25, 2003
- Tactical Fabs, Inc.
- Jeffrey L. May
- C40 - COMBINATORIAL CHEMISTRY
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,691,949
- Issue date Nov 25, 1997
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,514,884
- Issue date May 7, 1996
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,315,130
- Issue date May 24, 1994
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Very high density wafer scale device architecture
- Patent number 5,252,507
- Issue date Oct 12, 1993
- Tactical Fabs, Inc.
- James W. Hively
- G11 - INFORMATION STORAGE
Information Patent Grant
Package for an integrated circuit structure
- Patent number 5,223,741
- Issue date Jun 29, 1993
- Tactical Fabs, Inc.
- Richard L. Bechtel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multichip package with interconnect structure and heat...
- Patent number 5,182,632
- Issue date Jan 26, 1993
- Tactical Fabs, Inc.
- Richard L. Bechtel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and cell mount
- Patent number 4,836,861
- Issue date Jun 6, 1989
- Tactical Fabs, Inc.
- Douglas L. Peltzer
- H01 - BASIC ELECTRIC ELEMENTS

Tactical Fabs, Inc.

Organization

Patents Grantslast 30 patents

Roughened and oxidized well chips and method of making same

Very high density wafer scale device architecture

Very high density wafer scale device architecture

Very high density wafer scale device architecture

Very high density wafer scale device architecture

Package for an integrated circuit structure

High density multichip package with interconnect structure and heat...

Solar cell and cell mount

Patents Applicationslast 30 patents

Trademarklast 30 trademarks