TADATOMO SUGA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for joining transparent substrates
- Patent number 12,275,670
- Issue date Apr 15, 2025
- Tadatomo Suga
- Tadatomo Suga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 10,166,749
- Issue date Jan 1, 2019
- Lan Technical Service Co., Ltd.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component bonding method
- Patent number 8,915,418
- Issue date Dec 23, 2014
- Tadatomo Suga
- Toshiyuki Shiratori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection method and inspection apparatus
- Patent number 6,777,967
- Issue date Aug 17, 2004
- Tokyo Electron Limited
- Shinji Iino
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20100252615
- Publication date Oct 7, 2010
- Bondtech, Inc
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for bonding substrates and device for bonding substrates
- Publication number 20070128825
- Publication date Jun 7, 2007
- TADATOMO SUGA
- Tadatomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inspection method and inspection apparatus
- Publication number 20060192578
- Publication date Aug 31, 2006
- TOKYO ELECTON LIMITED
- Shinji Iino
- G01 - MEASURING TESTING
Information Patent Application
Method of mounting an electronic part
- Publication number 20040211060
- Publication date Oct 28, 2004
- TADATOMO SUGA
- Tadatomo Suga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Inspection method and inspection apparatus
- Publication number 20040174177
- Publication date Sep 9, 2004
- TOKYO ELECTRON LIMITED
- Shinji Iino
- G01 - MEASURING TESTING

Trademarklast 30 trademarks