TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,448,692
- Issue date Sep 20, 2022
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Jun He
- G01 - MEASURING TESTING

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