Tamura Kaken Co., Ltd.

Organization

Iruma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder, and paste solder composition
- Patent number 6,726,780
- Issue date Apr 27, 2004
- Tamura Kaken Corporation
- Takao Ono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering paste, soldering method, and surface-mounted type electro...
- Patent number 6,488,781
- Issue date Dec 3, 2002
- Denso Corporation
- Akira Tanahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Active energy beam curable composition and printed wiring board
- Patent number 6,475,701
- Issue date Nov 5, 2002
- Tamura Kaken Corporation
- Takao Ohno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin compositions, cured films thereof, and circuit...
- Patent number 6,156,462
- Issue date Dec 5, 2000
- Tamura Kaken Co., Ltd.
- Makoto Yanagawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Flux for soldering electronic components on circuit substrates, and...
- Patent number 5,863,355
- Issue date Jan 26, 1999
- Tamura Kaken Co., Ltd.
- Takao Ohno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin compositions, cured films thereof, and circuit...
- Patent number 5,853,957
- Issue date Dec 29, 1998
- Tamura Kaken Co., Ltd.
- Makoto Yanagawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed circuit board surface protective agent
- Patent number 5,735,973
- Issue date Apr 7, 1998
- Tamura Kaken Corporation
- Yasumichi Sasahara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photopolymerizable composition
- Patent number 5,723,261
- Issue date Mar 3, 1998
- Tamura Kaken Co., Ltd.
- Makoto Yanagawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photopolymerizable resin composition
- Patent number 5,468,784
- Issue date Nov 21, 1995
- Tamura Kaken Corporation
- Makoto Yanagawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photopolymerizable liquid photoimageable solder mask
- Patent number 5,100,767
- Issue date Mar 31, 1992
- Tamura Kaken Co., Ltd.
- Makoto Yanagawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solder powders coated with fluorine compounds, and solder pastes
- Patent number 4,994,326
- Issue date Feb 19, 1991
- Tamura Kaken Co., Ltd.
- Takashi Shimmura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering device
- Patent number 4,773,583
- Issue date Sep 27, 1988
- Tamura Kaken Co., Ltd.
- Ginya Ishii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin compositions
- Patent number 4,764,452
- Issue date Aug 16, 1988
- Tamura Kaken Co., Ltd.
- Takao Ohno
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photopolymerizable polyester containing compositions
- Patent number 4,293,636
- Issue date Oct 6, 1981
- Tamura Kaken Co., Ltd.
- Ken Okuya
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photopolymerizable ink compositions
- Patent number 4,271,258
- Issue date Jun 2, 1981
- Tamura Kaken Co., Ltd.
- Kiyosumi Watariguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

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Patents Applicationslast 30 patents

Information Patent Application
Method of removing lead, reclaimed metals and reclaimed products
- Publication number 20100112361
- Publication date May 6, 2010
- TAMURA KAKEN CORPORATION
- Satoru Kurita
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Thermosetting resin compositions, resin films and film articles
- Publication number 20050197425
- Publication date Sep 8, 2005
- TAMURA KAKEN CORPORATION
- Tetsuaki Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin compositions and film articles
- Publication number 20050181215
- Publication date Aug 18, 2005
- TAMURA KAKEN CORPORATION
- Tetsuaki Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Surface treatment agents for metal films of printed circuit boards
- Publication number 20050173678
- Publication date Aug 11, 2005
- TAMURA KAKEN CORPORATION
- Ichiro Miura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of manufacturing fine metal particles, substance containing...
- Publication number 20040211291
- Publication date Oct 28, 2004
- TAMURA KAKEN CORPORATION
- Takao Ono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photosensitive resin composition and printed wiring board
- Publication number 20030068567
- Publication date Apr 10, 2003
- TAMURA KAKEN CORPORATION
- Takao Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing fine metal particles, substance containing...
- Publication number 20030047034
- Publication date Mar 13, 2003
- TAMURA KAKEN CORPORATION
- Takao Ono
- B22 - CASTING POWDER METALLURGY

Tamura Kaken Co., Ltd.

Organization

Patents Grantslast 30 patents

Lead-free solder, and paste solder composition

Soldering paste, soldering method, and surface-mounted type electro...

Active energy beam curable composition and printed wiring board

Photosensitive resin compositions, cured films thereof, and circuit...

Flux for soldering electronic components on circuit substrates, and...

Photosensitive resin compositions, cured films thereof, and circuit...

Printed circuit board surface protective agent

Photopolymerizable composition

Photopolymerizable resin composition

Photopolymerizable liquid photoimageable solder mask

Solder powders coated with fluorine compounds, and solder pastes

Soldering device

Photosensitive resin compositions

Photopolymerizable polyester containing compositions

Photopolymerizable ink compositions

Patents Applicationslast 30 patents

Method of removing lead, reclaimed metals and reclaimed products

Thermosetting resin compositions, resin films and film articles

Thermosetting resin compositions and film articles

Surface treatment agents for metal films of printed circuit boards

Method of manufacturing fine metal particles, substance containing...

Photosensitive resin composition and printed wiring board

Method of manufacturing fine metal particles, substance containing...