TECHNISCHE UNIVERSITAT CHEMNITZ

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Chemnitz, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for contacting and packetising a semiconductor chip
- Patent number 11,749,638
- Issue date Sep 5, 2023
- Technische Universität Chemnitz
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS-CONFIGURABLE NANOELECTRONIC COMPONENT STRUCTURE, INTERMEDIAT...
- Publication number 20240145601
- Publication date May 2, 2024
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Sascha Hermann
- B82 - NANO-TECHNOLOGY
Information Patent Application
Component Made from a Material Consisting Predominantly of Renewabl...
- Publication number 20220274282
- Publication date Sep 1, 2022
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Christoph Alt
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...
Information Patent Application
Method for Contacting and Packetising a Semiconductor Chip
- Publication number 20220181291
- Publication date Jun 9, 2022
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE CROSS-LINKING SYSTEM FOR POLYVINYLAMINES
- Publication number 20210395406
- Publication date Dec 23, 2021
- Solenis Technologies, L.P.
- Florian Taubert
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20210147223
- Publication date May 20, 2021
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Roman Forke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device and Method for Producing a Component by Means of 3D Multi-Ma...
- Publication number 20210060863
- Publication date Mar 4, 2021
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LAYER SYSTEM HAVING A LAYER OF CARBON NANOTUBES ARRANGED PARALLEL T...
- Publication number 20140321026
- Publication date Oct 30, 2014
- Fraunhofer-Gesellschaft zur Foerderung der angerwandten Forschung e.V.
- Sascha Hermann
- B82 - NANO-TECHNOLOGY

TECHNISCHE UNIVERSITAT CHEMNITZ

Organization

Patents Grantslast 30 patents

Method for contacting and packetising a semiconductor chip

Patents Applicationslast 30 patents

STRESS-CONFIGURABLE NANOELECTRONIC COMPONENT STRUCTURE, INTERMEDIAT...

Component Made from a Material Consisting Predominantly of Renewabl...

Method for Contacting and Packetising a Semiconductor Chip

REVERSIBLE CROSS-LINKING SYSTEM FOR POLYVINYLAMINES

MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME

Device and Method for Producing a Component by Means of 3D Multi-Ma...

LAYER SYSTEM HAVING A LAYER OF CARBON NANOTUBES ARRANGED PARALLEL T...

Trademarklast 30 trademarks