Teikoku Seiki Kabushiki Kaisha

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Tape extension device for semiconductor producing apparatus and sem...
- Patent number 5,590,445
- Issue date Jan 7, 1997
- Teikoku Seiki Kabushiki Kaisha
- Masahiro Lee
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method of supporting wafer, wafer supporting apparatus and wafer mo...
- Patent number 5,281,297
- Issue date Jan 25, 1994
- Teikoku Seiki Kabushiki Kaisha
- Masahiro Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of cutting off a portion of masking film adhered...
- Patent number 4,779,497
- Issue date Oct 25, 1988
- Teikoku Seiki Kabushiki Kaisha
- Masahiro Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR