THIN MATERIALS AG

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Eichenau, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating a layer system comprising a wafer by precisel...
- Patent number 8,951,886
- Issue date Feb 10, 2015
- Thin Materials AG
- Franz Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing, in particular, thin rear sides of a wafer, w...
- Patent number 8,911,583
- Issue date Dec 16, 2014
- Thin Materials AG
- Andreas Jakob
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 8,641,859
- Issue date Feb 4, 2014
- Thin Materials AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SEPARATING A LAYER SYSTEM COMPRISING A WAFER
- Publication number 20120028438
- Publication date Feb 2, 2012
- THIN MATERIALS AG
- Franz Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20110272092
- Publication date Nov 10, 2011
- THIN MATERIALS AG
- Franz Richter
- B32 - LAYERED PRODUCTS

Trademarklast 30 trademarks