THRUCHIP JAPAN, INC

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TOKYO, JP

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Patents Grantslast 30 patents

Information Patent Grant
Inductive relayed coupling circuit between substrates
- Patent number 9,979,441
- Issue date May 22, 2018
- THRUCHIP JAPAN INC.
- Tadahiro Kuroda
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer semiconductor integrated circuit device
- Patent number 9,978,717
- Issue date May 22, 2018
- THRUCHIP JAPAN INC.
- Tadahiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and layered circuit provided therewith
- Patent number 9,749,020
- Issue date Aug 29, 2017
- ThruChip Japan, Inc.
- Tadahiro Kuroda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

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Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20160379958
- Publication date Dec 29, 2016
- THRUCHIP JAPAN INC.
- Tadahiro Kuroda
- H01 - BASIC ELECTRIC ELEMENTS