TransSiP, Inc.

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Irvine, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Time and frequency domain signal conditioning device for switching...
- Patent number 12,044,731
- Issue date Jul 23, 2024
- TRANSSIP, INC.
- Chih Wei Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Time and frequency domain signal conditioning device for switching...
- Patent number 11,243,249
- Issue date Feb 8, 2022
- TRANSSIP, INC.
- Chih Wei Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit arrangement for switching noise jitter (SNJ) reduction in f...
- Patent number 10,942,219
- Issue date Mar 9, 2021
- TRANSSIP, INC.
- Chih Wei Wong
- G01 - MEASURING TESTING
Information Patent Grant
EMI shielded integrated circuit packages and methods of making the...
- Patent number 10,319,685
- Issue date Jun 11, 2019
- TRANSSIP, INC.
- Chih Wei Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metamaterial substrate for circuit design
- Patent number 9,748,663
- Issue date Aug 29, 2017
- TRANSSIP, INC.
- Chih Wei Wong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Time And Frequency Domain Signal Conditioning Device For Switching...
- Publication number 20220113352
- Publication date Apr 14, 2022
- TransSiP, Inc.
- Chih Wei Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Arrangement For Switching Noise Jitter (SNJ) Reduction In F...
- Publication number 20190064264
- Publication date Feb 28, 2019
- TransSiP, Inc.
- Chih Wei Wong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Time And Frequency Domain Signal Conditioning Device For Switching...
- Publication number 20190006937
- Publication date Jan 3, 2019
- TransSiP, Inc.
- Chih Wei Wong
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
EMI Shielded Integrated Circuit Packages And Methods Of Making The...
- Publication number 20180240757
- Publication date Aug 23, 2018
- TransSiP, Inc.
- Chih Wei WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metamaterial Substrate For Circuit Design
- Publication number 20170033468
- Publication date Feb 2, 2017
- TransSiP, Inc.
- Chih Wei Wong
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks