TREA

TTM ADVANCED CIRCUITS, INC

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Organization

  • CHIPPEWA FALLS, WI, US
Organizations

Patents Grantslast 30 patents

  • Information Patent Grant

    Filling device
    • Patent number 7,066,378
    • Issue date Jun 27, 2006
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Hole filling using an etched hole-fill stand-off
    • Patent number 6,921,505
    • Issue date Jul 26, 2005
    • TTM Advanced Circuits, Inc.
    • Bruce W. Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    PCB support plate for PCB via fill
    • Patent number 6,855,385
    • Issue date Feb 15, 2005
    • TTM Advanced Circuits, Inc.
    • Charles W. Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Scavenging system
    • Patent number 6,840,425
    • Issue date Jan 11, 2005
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heated filling device
    • Patent number 6,832,714
    • Issue date Dec 21, 2004
    • TTM Advanced Circuits, Inc.
    • Jesse Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Filling method
    • Patent number 6,814,918
    • Issue date Nov 9, 2004
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    PCB support plate method for PCB via fill
    • Patent number 6,800,232
    • Issue date Oct 5, 2004
    • TTM Advanced Circuits, Inc.
    • Charles W. Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Scavenging method
    • Patent number 6,793,852
    • Issue date Sep 21, 2004
    • TTM Advanced Circuits, Inc.
    • Jesse L. Pedigo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR