UBOTIC COMPANY LIMITED

Organization

Tsuen Wan, CN

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Carrier substrate, package, and method of manufacture
- Patent number 10,777,457
- Issue date Sep 15, 2020
- Ubotic Company Limited
- Ming-Wa Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass flow sensor module and method of manufacture
- Patent number 10,458,826
- Issue date Oct 29, 2019
- UBOTIC COMPANY LIMITED
- Ming-Wa Tam
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cavity package with pre-molded substrate
- Patent number 10,014,187
- Issue date Jul 3, 2018
- Ubotic Company Limited
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method of manufacture
- Patent number 9,991,194
- Issue date Jun 5, 2018
- Ubotic Company Limited
- Ming-Wa Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with die attach pad
- Patent number 9,887,149
- Issue date Feb 6, 2018
- Ubotic Company Limited
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power and high frequency plastic pre-molded cavity package
- Patent number 9,865,528
- Issue date Jan 9, 2018
- UBOTIC COMPANY LIMITED
- Zhang Xiao Ping
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with pre-molded substrate
- Patent number 9,659,855
- Issue date May 23, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with die attach pad
- Patent number 9,601,413
- Issue date Mar 21, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with pre-molded cavity leadframe
- Patent number 9,536,812
- Issue date Jan 3, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor housing
- Patent number D757538
- Issue date May 31, 2016
- UBOTIC COMPANY LIMITED
- Ming-Wa Tam
- D09 - Packages and containers for goods
Information Patent Grant
Cavity package with pre-molded cavity leadframe
- Patent number 9,257,370
- Issue date Feb 9, 2016
- UBOTIC COMPANY LIMITED
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FARADAY CAGE PLASTIC CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME
- Publication number 20220384362
- Publication date Dec 1, 2022
- UBOTIC COMPANY LIMITED
- Ming-Wa TAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE, PACKAGE, AND METHOD OF MANUFACTURE
- Publication number 20190103313
- Publication date Apr 4, 2019
- Ubotic Company Limited
- Ming-Wa TAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASS FLOW SENSOR MODULE AND METHOD OF MANUFACTURE
- Publication number 20190063971
- Publication date Feb 28, 2019
- Ubotic Company Limited
- Ming-Wa TAM
- G01 - MEASURING TESTING
Information Patent Application
HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE
- Publication number 20180122729
- Publication date May 3, 2018
- UBOTIC COMPANY LIMITED
- Zhang Xiao PING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE
- Publication number 20170221726
- Publication date Aug 3, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE
- Publication number 20170170102
- Publication date Jun 15, 2017
- UBOTIC COMPANY LIMITED
- Zhang Xiao PING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH DIE ATTACH PAD
- Publication number 20170141016
- Publication date May 18, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME
- Publication number 20160126164
- Publication date May 5, 2016
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SHIELDING CAVITY PACKAGE
- Publication number 20160020177
- Publication date Jan 21, 2016
- Ubotic Company Limited
- Ming-Wa TAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE
- Publication number 20150060116
- Publication date Mar 5, 2015
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME
- Publication number 20150061094
- Publication date Mar 5, 2015
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY PACKAGE WITH DIE ATTACH PAD
- Publication number 20140306333
- Publication date Oct 16, 2014
- UBOTIC COMPANY LIMITED
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS

UBOTIC COMPANY LIMITED

Organization

Patents Grantslast 30 patents

Carrier substrate, package, and method of manufacture

Mass flow sensor module and method of manufacture

Cavity package with pre-molded substrate

Sensor package and method of manufacture

Cavity package with die attach pad

High power and high frequency plastic pre-molded cavity package

Cavity package with pre-molded substrate

Cavity package with die attach pad

Cavity package with pre-molded cavity leadframe

Sensor housing

Cavity package with pre-molded cavity leadframe

Patents Applicationslast 30 patents

FARADAY CAGE PLASTIC CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME

CARRIER SUBSTRATE, PACKAGE, AND METHOD OF MANUFACTURE

MASS FLOW SENSOR MODULE AND METHOD OF MANUFACTURE

HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE

CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE

HIGH POWER AND HIGH FREQUENCY PLASTIC PRE-MOLDED CAVITY PACKAGE

CAVITY PACKAGE WITH DIE ATTACH PAD

CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME

RADIO FREQUENCY SHIELDING CAVITY PACKAGE

CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE

CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME

CAVITY PACKAGE WITH DIE ATTACH PAD

Trademarklast 30 trademarks